{"title":"The Characteristics and Reliability With Channel Length Dependent on the Deposited Sequence of SiO₂ and Si₃N₄ as PV in LTPS TFTs","authors":"Chuan-Wei Kuo;Tsung-Ming Tsai;Ting-Chang Chang;Hong-Yi Tu;Yu-Hsiang Tsai;Jian-Jie Chen;I-Yu Huang","doi":"10.1109/TDMR.2024.3379743","DOIUrl":null,"url":null,"abstract":"This study investigates the characteristics on different channel lengths for a sequence of Si3N4 and SiO2 deposition as PV of LTPS TFTs. After analyzing the subthreshold swing (SS) of the initial condition and change in the \n<inline-formula> <tex-math>$\\Delta \\text{V}_{\\text{TH}}$ </tex-math></inline-formula>\n after NBTI and PBTI operations, a degradation mechanism is identified. When Si3N4 is deposited as the first layer of passivation (PV), hydrogen diffuses into the channel owing to activation or thermal annealing. As the channel length decreases, the hydrogen concentration increases at the center of the channel for devices with Si3N4 as the first layer of PV. Elevated hydrogen concentrations in the center of short channel devices lead to a debased SS. Moreover, the more positive fixed oxide charges create a more pronounced degradation after NBTI operation. On the other hand, PBTI performance shows a milder degradation with decreasing channel length due to fewer trapping charges. Finally, the hydrogen concentration is verified using SIMS. In summary, the heightened degradation of NBTI with device scaling is attributed to excess hydrogen on channel center during Si3N4 film deposition. The uneven hydrogen distribution also contributes the different SS and the different degradation after PBTI operation with different channel length.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 2","pages":"268-274"},"PeriodicalIF":2.5000,"publicationDate":"2024-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10487992/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigates the characteristics on different channel lengths for a sequence of Si3N4 and SiO2 deposition as PV of LTPS TFTs. After analyzing the subthreshold swing (SS) of the initial condition and change in the
$\Delta \text{V}_{\text{TH}}$
after NBTI and PBTI operations, a degradation mechanism is identified. When Si3N4 is deposited as the first layer of passivation (PV), hydrogen diffuses into the channel owing to activation or thermal annealing. As the channel length decreases, the hydrogen concentration increases at the center of the channel for devices with Si3N4 as the first layer of PV. Elevated hydrogen concentrations in the center of short channel devices lead to a debased SS. Moreover, the more positive fixed oxide charges create a more pronounced degradation after NBTI operation. On the other hand, PBTI performance shows a milder degradation with decreasing channel length due to fewer trapping charges. Finally, the hydrogen concentration is verified using SIMS. In summary, the heightened degradation of NBTI with device scaling is attributed to excess hydrogen on channel center during Si3N4 film deposition. The uneven hydrogen distribution also contributes the different SS and the different degradation after PBTI operation with different channel length.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.