Stretch‐tolerant PECVD gas barrier coatings for sustainable flexible packaging

IF 2.9 3区 物理与天体物理 Q2 PHYSICS, APPLIED Plasma Processes and Polymers Pub Date : 2024-04-19 DOI:10.1002/ppap.202400018
Philipp Alizadeh, Jonas Franke, Rainer Dahlmann
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Abstract

This study employs X‐ray photoelectron spectroscopy (XPS), thickness measurements, permeation analysis and laser scanning microscopy to analyse the stretch tolerance in dependence of the chemical composition and deposition rates of plasma‐enhanced chemical vapour deposition coatings. SiOx and SiOCH coatings are deposited on polyethylene terephthalate film using a full factorial study design of three parameters (monomer/oxygen mass flow and pulse duration). They exhibit distinct differences, with the monomer mass flow emerging as a critical factor influencing deposition rates and stretch tolerance. SiOCH coatings demonstrate faster growth rates due to higher monomer flow. SiOx coatings exhibit superior barrier performance. Stretch tolerance does not solely correlate with atomic composition, since a SiOx coating with higher‐than‐predicted stretch tolerance was observed.
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用于可持续软包装的耐拉伸 PECVD 气体阻隔涂层
本研究采用 X 射线光电子能谱 (XPS)、厚度测量、渗透分析和激光扫描显微镜来分析等离子体增强化学气相沉积涂层的拉伸耐受性与化学成分和沉积速率的关系。通过对三个参数(单体/氧气质量流量和脉冲持续时间)进行全因子研究设计,在聚对苯二甲酸乙二醇酯薄膜上沉积了 SiOx 和 SiOCH 涂层。它们表现出明显的差异,其中单体质量流量是影响沉积速率和拉伸耐受性的关键因素。由于单体流量较高,SiOCH 涂层的生长速度更快。SiOx 涂层则表现出更优异的阻隔性能。拉伸耐受性并不完全与原子成分相关,因为观察到一种氧化硅涂层的拉伸耐受性高于预测值。
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来源期刊
Plasma Processes and Polymers
Plasma Processes and Polymers 物理-高分子科学
CiteScore
6.60
自引率
11.40%
发文量
150
审稿时长
3 months
期刊介绍: Plasma Processes & Polymers focuses on the interdisciplinary field of low temperature plasma science, covering both experimental and theoretical aspects of fundamental and applied research in materials science, physics, chemistry and engineering in the area of plasma sources and plasma-based treatments.
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