Engineered substrates for metasurface antennas

IF 4.2 Q2 ENGINEERING, MANUFACTURING Additive manufacturing letters Pub Date : 2024-04-01 DOI:10.1016/j.addlet.2024.100212

Kelvin J. Nicholson , Ellen Gupta , Colin Bonner , Theodore Fessaras , Mark Mirotznik

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Abstract

This letter explores the advantages of additively manufactured substrates with spatially varying electromagnetic properties. These engineered substrates will be constructed using space filling curves (SFC) of various orders. New advanced manufacturing systems such as the nScrypt 3Dn-300, have enabled the rapid fabrication of these SFC substrates. This letter will apply the engineered SFC substrate to the design and fabrication of metasurface antennas. By utilising a SFC to vary the local substrate permittivity, along with the printed conductive patch dimensions, the range of achievable surface impedances can be greatly expanded. This enlarged design space will be leveraged to yield increased gain for a given metasurface antenna size. Methods to characterise the substrate permittivity and conductive ink are discussed along with a complete description of the metasurface antenna design, fabrication and validation process.

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用于超表面天线的工程基底

这封信探讨了具有空间变化电磁特性的快速制造基底的优势。这些工程基板将使用不同阶数的空间填充曲线（SFC）来制造。新的先进制造系统（如 nScrypt 3Dn-300 ）能够快速制造这些 SFC 基底面。这封信将把工程 SFC 基底应用于元表面天线的设计和制造。通过利用 SFC 改变局部基底介电常数和印刷导电贴片尺寸，可以大大扩展可实现的表面阻抗范围。利用这一扩大的设计空间，可以在给定的元面天线尺寸下获得更高的增益。本文讨论了表征基底介电常数和导电油墨的方法，并完整描述了元表面天线的设计、制造和验证过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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