Ultrafast gelling bioadhesive based on blood plasma and gelatin for wound closure and healing.

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-04-24 DOI:10.1088/1748-605X/ad42ec
Ritvesh Gupta, D. Verma
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Abstract

Tissue adhesives offer a plethora of advantages in achieving efficient wound closure over conventional sutures and staples. Such materials are of great value, especially in cases where suturing could potentially damage tissues or compromise blood flow or in cases of hard-to-reach areas. Besides providing wound closure, the tissue adhesives must also facilitate wound healing. Previously, plasma-based tissue adhesives and similar bioinspired strategies have been utilized to aid in wound healing. Still, their application is constrained by factors such as high cost, diminished biocompatibility, prolonged gelation times, inadequate swelling, quick resorption, as well as short-term and inconsistent efficacy. To address these limitations, we report the development of a highly biocompatible and ultrafast-gelling tissue adhesive hydrogels. Freeze-dried platelet-rich plasma (PRP), heat-denatured freeze-dried platelet-poor plasma (PPP), and gelatin were utilized as the base matrix. Gelation was initiated by adding Tetrakis hydroxymethyl phosphonium chloride (THPC). The fabricated gels displayed rapid gelation (3-4 s), low swelling, increased proliferation, and migration against L929 cells and had porcine skin tissue adhesion strength similar to that of plasma-based commercial glue (Tisseel®). .
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基于血浆和明胶的超快胶凝生物粘合剂,用于伤口闭合和愈合。
与传统缝合线和订书针相比,组织粘合剂在实现高效伤口闭合方面具有众多优势。尤其是在缝合可能会损伤组织或影响血流的情况下,或者在难以触及的区域,这类材料具有极大的价值。除了闭合伤口,组织粘合剂还必须促进伤口愈合。以前,人们曾利用基于血浆的组织粘合剂和类似的生物启发策略来帮助伤口愈合。然而,它们的应用仍然受到成本高、生物相容性差、凝胶时间长、肿胀不足、吸收快以及短期疗效不稳定等因素的制约。为了解决这些局限性,我们报告了一种高生物相容性和超快凝胶组织粘合剂水凝胶的开发情况。冻干富血小板血浆(PRP)、热变性冻干贫血小板血浆(PPP)和明胶被用作基质。加入四羟甲基氯化磷(THPC)后开始凝胶化。制成的凝胶显示出快速凝胶化(3-4 秒)、低膨胀性、增殖性和对 L929 细胞的迁移性,其猪皮组织粘附强度与基于血浆的商用胶水(Tisseel®)相似。.
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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