Ar transport and blister growth kinetics in titania-doped germania-based optical coatings

É. Lalande, Aaron Davenport, Lory Marchand, Ashot Markosyan, Daniel Martinez, A. Paolone, M. Rezac, M. Bazzan, M. Chicoine, Julien Colaux, Matthieu Coulon, M. Fejer, A. Lussier, E. Majorana, Ludvik Martinu, Carmen Menoni, Christophe Michel, Fulvio Ricci, F. Schiettekatte, Nikita Shcheblanov, Joshua R Smith, J. Teillon, G. Terwagne, G. Vajente
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Abstract

Blistering is a phenomenon sometimes observed in sputtered-deposited thin films but seldom investigated in detail. Here, we consider the case of titania-doped germania (TGO)/silica multi-layers deposited by ion beam sputtering. TGO is a candidate as high refractive index material in the Bragg mirrors for the next iteration of gravitational waves detectors. It needs to be annealed at 600°C for 100h in order to reach the desired relaxation state. However under some growth conditions, in 52-layer TGO/silica stacks, blistering occurs upon annealing at a temperature near 500°C, which corresponds to the temperature where Ar desorbs from TGO. In order to better understand the blistering phenomenon, we measure the Ar transport in single layers of TGO and silica. In the case of <1 μm-thick TGO layers, the Ar desorption is mainly limited by detrapping. The transport model also correctly predicts the evolution of the total amount of Ar in a 8.5 μm stack of TGO and silica layers annealed at 450°C, but in that case, the process is mainly limited by diffusion. Since Ar diffusion is an order of magnitude slower in TGO compared to silica, we observe a correspondingly strong accumulation of Ar in TGO. The Ar transport model is used to explain some regimes of the blisters growth, and we find indications that Ar accumulation is a driver for their growth in general, but the blisters nucleation remains a complex phenomenon influenced by several other factors including stress, substrate roughness, and impurities.
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掺杂二氧化钛的锗基光学镀膜中的氩传输和砂眼生长动力学
有时会在溅射沉积薄膜中观察到起泡现象,但很少对其进行详细研究。在此,我们考虑了通过离子束溅射沉积的掺钛锗(TGO)/二氧化硅多层膜的情况。TGO 是下一代引力波探测器布拉格反射镜的高折射率候选材料。它需要在 600°C 下退火 100 小时才能达到所需的弛豫状态。然而,在某些生长条件下,52 层 TGO/二氧化硅叠层在退火温度接近 500°C 时会出现起泡现象,而这一温度与 Ar 从 TGO 中脱附的温度相对应。为了更好地理解起泡现象,我们测量了单层 TGO 和二氧化硅中的氩传输。在厚度小于 1 μm 的 TGO 层中,氩的解吸主要受脱附限制。该传输模型还正确预测了在 450°C 下退火的 8.5 μm TGO 和二氧化硅层中氩气总量的变化,但在这种情况下,该过程主要受限于扩散。由于氩气在 TGO 中的扩散速度比在二氧化硅中慢一个数量级,我们观察到氩气在 TGO 中有相应的大量积累。我们用氩气传输模型解释了水泡生长的某些情况,并发现有迹象表明,氩气积累是水泡生长的一般驱动力,但水泡成核仍然是一个复杂的现象,受到其他几个因素的影响,包括应力、基底粗糙度和杂质。
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