I. Dey, Raphael Floeder, Rick Solcà, T. Schudeleit, Konrad Wegener
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引用次数: 0
Abstract
Additive manufacturing (AM) by using direct metal deposition (DMD) often causes erratic distortion patterns, especially on large parts. This study presents a systematic distortion analysis by employing numerical approaches using transient–thermal and structural simulations, experimental approaches using tomography, X-ray diffraction (XRD), and an analytical approach calculating the buckling distortion of a piston. The most essential geometrical features are thin walls situated between massive rings. An eigenvalue buckling analysis, a DMD process, and heat treatment simulation are presented. The eigenvalue buckling simulation shows that it is highly dependent on the mesh size. The computational effort of the DMD and heat treatment simulation was reduced through simplifications. Moreover, artificial imperfections were imposed in the heat treatment simulation, which moved the part into the buckling state inspired by the experiment. Although the numerical results of both simulations are successful, the eigenvalue and DMD simulation cannot be validated through tomography and XRD. This is because tomography is unable to measure small elastic strain fields, the simulated residual stresses were overestimated, and the part removal disturbed the residual stress equilibrium. Nevertheless, the heat treatment simulation can predict the distortion pattern caused by an inhomogeneous temperature field during ambient cooling in an oven. The massive piston skirt cools down and shrinks faster than the massive core. The reduced yield strength at elevated temperatures and critical buckling load leads to plastic deformation of the thin walls.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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