Interrelations between Printing Patterns and Residual Stress in Fused Deposition Modelling for the 4D Printing of Acrylonitrile Butadiene Styrene and Wood–Plastic Composites
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引用次数: 0
Abstract
Four dimensional printing enables the advanced manufacturing of smart objects that can morph and adapt shape over time in response to stimuli such as heat. This study presents a single-material 4D printing workflow which explores the residual stress and anisotropy arising from the fused deposition modelling (FDM) printing process to create heat-triggered self-morphing objects. In particular, the study first investigates the effect of printing patterns on the residual stress of FDM-printed acrylonitrile butadiene styrene (ABS) products. Through finite element analysis, the raster angle of printing patterns was identified as the key parameter influencing the distribution of residual stresses. Experimental investigations further reveal that the non-uniform distribution of residual stress results in the anisotropic thermal deformation of printed materials. Thus, through the design of printing patterns, FDM-printed materials can be programmed with desired built-in residual stresses and anisotropic behaviours for initiating and controlling the transformation of 4D-printed objects. Using the proposed approach, any desktop FDM printers can be turned into 4D printers to create smart objects that can self-morph into target geometries. A series of 4D printing prototypes manufactured from conventional ABS 3D printing feedstock are tested to illustrate the use and reliability of this new workflow. Additionally, the custom-made wood–plastic composite (WPC) feedstocks are explored in this study to demonstrate the transposability of the 4D printing approach.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
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CAS
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