Masafumi Yokoyama, F. Horikiri, Hisashi Mori, Taichiro Konno, H. Fujikura
{"title":"Fabrication of free-standing GaN substrates using electrochemically formed porous separation layers","authors":"Masafumi Yokoyama, F. Horikiri, Hisashi Mori, Taichiro Konno, H. Fujikura","doi":"10.35848/1882-0786/ad3a2f","DOIUrl":null,"url":null,"abstract":"\n We have developed a pore-assisted separation (PAS) method for the fabrication of free-standing GaN substrates, where bulk GaN crystals were separated from seed GaN templates at electrochemically formed porous layers. The pore size was controlled by the electrochemical process conditions and must be greater than 100 nm to realize separation within whole wafers. A 2-inch free-standing GaN substrate having a low dislocation density of 2.7×106 cm−2 was realized by growth of an 800-μm-thick GaN layer on the porous GaN template. A 3-inch free-standing GaN substrate was also fabricated by the PAS method, indicating its good scalability.","PeriodicalId":503885,"journal":{"name":"Applied Physics Express","volume":"44 5","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Physics Express","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.35848/1882-0786/ad3a2f","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We have developed a pore-assisted separation (PAS) method for the fabrication of free-standing GaN substrates, where bulk GaN crystals were separated from seed GaN templates at electrochemically formed porous layers. The pore size was controlled by the electrochemical process conditions and must be greater than 100 nm to realize separation within whole wafers. A 2-inch free-standing GaN substrate having a low dislocation density of 2.7×106 cm−2 was realized by growth of an 800-μm-thick GaN layer on the porous GaN template. A 3-inch free-standing GaN substrate was also fabricated by the PAS method, indicating its good scalability.