DNA methylation episignature and comparative epigenomic profiling for Pitt-Hopkins syndrome caused by TCF4 variants.

IF 4.7 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-04-01 DOI:10.1016/j.xhgg.2024.100289

Liselot van der Laan, Peter Lauffer, Kathleen Rooney, Ananília Silva, Sadegheh Haghshenas, R. Relator, M. Levy, S. Trajkova, Sylvia A Huisman, E. Bijlsma, T. Kleefstra, B. V. van Bon, Özlem Baysal, Christiane Zweier, M. Palomares-Bralo, Jan Fischer, K. Szakszon, Laurence Faivre, Amélie Piton, S. Mesman, Ron Hochstenbach, M. Elting, J. M. van Hagen, Astrid S Plomp, M. Mannens, Marielle Alders, M. M. van Haelst, G. B. Ferrero, Alfredo Brusco, P. Henneman, D. Sweetser, B. Sadikovic, A. Vitobello, L. Menke

引用次数: 0

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

TCF4变体导致的皮特-霍普金斯综合征的DNA甲基化表征和表观基因组比较分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico

期刊最新文献

Issue Editorial Masthead Issue Publication Information Marking the 100th Issue of ACS Applied Electronic Materials Pushing down the Limit of Ammonia Detection of ZnO-Based Chemiresistive Sensors with Exposed Hexagonal Facets at Room Temperature Direct-Printed Mn–Ni–Cu–O/Poly(vinyl butyral) Composites for Sintering-Free, Flexible Thermistors with High Sensitivity