Semantic Segmentation for Noisy and Limited Wafer Transmission Electron Microscope Images

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-05-03 DOI:10.1109/tsm.2024.3396423

Yongwon Jo, Jinsoo Bae, Hansam Cho, Heejoong Roh, Kyunghye Kim, Munki Jo, Jaeung Tae, Seoung Bum Kim

引用次数: 0

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

噪声和有限晶片透射电子显微镜图像的语义分割

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.

期刊最新文献

A Real-Time Automatic Structural-Loss Detection and Stopping Rule of Semiconductor Single-Crystal-Silicon-Growth <100> and <111> Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi Path DCNN DSH to Extend-DSH: Chip-level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy Virtual Metrology of Critical Dimensions in Plasma Etch Processes using Entire Optical Emission Spectrum Identifying Good-Dice-in-Bad-Neighborhoods Using Artificial Neural Networks