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IEEE Transactions on Semiconductor Manufacturing最新文献

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Overlay Measurement Algorithm for Moirè Targets Using Frequency Analysis 利用频率分析的莫伊雷目标叠加测量算法
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-09-12 DOI: 10.1109/tsm.2024.3431207
Hyunchul Lee, Hyunjin Chang, Hosung Woo, WonGu Lee
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引用次数: 0
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics 基于功能数据分析和汇总统计的监督学习模型性能评估
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-09-02 DOI: 10.1109/tsm.2024.3452947
Yonghan Ju, Yung-Seop Lee
{"title":"Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics","authors":"Yonghan Ju, Yung-Seop Lee","doi":"10.1109/tsm.2024.3452947","DOIUrl":"https://doi.org/10.1109/tsm.2024.3452947","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"58 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine Learning Based Universal Threshold Voltage Extraction of Transistors Using Convolutional Neural Networks 使用卷积神经网络提取基于机器学习的晶体管通用阈值电压
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-28 DOI: 10.1109/tsm.2024.3450286
Hüsnü Murat Koçak, Jesse Davis, Michel Houssa, Ahmet Teoman Naskali, Jerome Mitard
{"title":"Machine Learning Based Universal Threshold Voltage Extraction of Transistors Using Convolutional Neural Networks","authors":"Hüsnü Murat Koçak, Jesse Davis, Michel Houssa, Ahmet Teoman Naskali, Jerome Mitard","doi":"10.1109/tsm.2024.3450286","DOIUrl":"https://doi.org/10.1109/tsm.2024.3450286","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"34 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry 在散射测量中使用空间光调制器从衍射图像中提取特征
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-23 DOI: 10.1109/tsm.2024.3448458
Jinyang Li, Hung-Fei Kuo
{"title":"Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry","authors":"Jinyang Li, Hung-Fei Kuo","doi":"10.1109/tsm.2024.3448458","DOIUrl":"https://doi.org/10.1109/tsm.2024.3448458","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"25 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel Multi-Modal Learning Approach for Cross-Process Defect Classification in TFT-LCD Array Manufacturing 用于 TFT-LCD 阵列制造中跨工序缺陷分类的新型多模式学习方法
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-23 DOI: 10.1109/tsm.2024.3448359
Yi Liu, Wei-Te Lee, Hsueh-Ping Lu, Hung-Wen Chen
{"title":"A Novel Multi-Modal Learning Approach for Cross-Process Defect Classification in TFT-LCD Array Manufacturing","authors":"Yi Liu, Wei-Te Lee, Hsueh-Ping Lu, Hung-Wen Chen","doi":"10.1109/tsm.2024.3448359","DOIUrl":"https://doi.org/10.1109/tsm.2024.3448359","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"1204 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimizing Scanning Acoustic Tomography Image Segmentation With Segment Anything Model for Semiconductor Devices 利用半导体器件分段模型优化扫描声断层扫描图像分割
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-23 DOI: 10.1109/tsm.2024.3444850
Thi Thu Ha Vu, Tan Hung Vo, Trong Nhan Nguyen, Jaeyeop Choi, Sudip Mondal, Junghwan Oh
{"title":"Optimizing Scanning Acoustic Tomography Image Segmentation With Segment Anything Model for Semiconductor Devices","authors":"Thi Thu Ha Vu, Tan Hung Vo, Trong Nhan Nguyen, Jaeyeop Choi, Sudip Mondal, Junghwan Oh","doi":"10.1109/tsm.2024.3444850","DOIUrl":"https://doi.org/10.1109/tsm.2024.3444850","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"12 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography 利用太赫兹飞行时间断层扫描对微电子共形涂层厚度进行无损测绘的比较研究
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-22 DOI: 10.1109/tsm.2024.3447892
Min Zhai, Serena Calvelli, Haolian Shi, Marco Ricci, S. Laureti, Prabjit Singh, Haley Fu, Alexandre Locquet, D. S. Citrin
{"title":"Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography","authors":"Min Zhai, Serena Calvelli, Haolian Shi, Marco Ricci, S. Laureti, Prabjit Singh, Haley Fu, Alexandre Locquet, D. S. Citrin","doi":"10.1109/tsm.2024.3447892","DOIUrl":"https://doi.org/10.1109/tsm.2024.3447892","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"21 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Application of Plasma Information-Based Virtual Metrology (PI-VM) for Etching in C4F8/Ar/O2 Plasma 在 C4F8/Ar/O2 等离子体蚀刻中应用基于等离子体信息的虚拟计量学 (PI-VM)
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-21 DOI: 10.1109/tsm.2024.3447074
Gwanjoong Kim, Ji-Won Kwon, Ingyu Lee, Hwiwon Seo, Jong-Bae Park, Jong-Hyun Shin, Gon-Ho Kim
{"title":"Application of Plasma Information-Based Virtual Metrology (PI-VM) for Etching in C4F8/Ar/O2 Plasma","authors":"Gwanjoong Kim, Ji-Won Kwon, Ingyu Lee, Hwiwon Seo, Jong-Bae Park, Jong-Hyun Shin, Gon-Ho Kim","doi":"10.1109/tsm.2024.3447074","DOIUrl":"https://doi.org/10.1109/tsm.2024.3447074","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"2677 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Group-Exclusive Feature Group Lasso and Applications to Automatic Sensor Selection for Virtual Metrology in Semiconductor Manufacturing 组专属特征组套索及其在半导体制造虚拟计量自动传感器选择中的应用
IF 2.7 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-21 DOI: 10.1109/tsm.2024.3444720
Jeongsub Choi, Youngdoo Son, Jihoon Kang
{"title":"Group-Exclusive Feature Group Lasso and Applications to Automatic Sensor Selection for Virtual Metrology in Semiconductor Manufacturing","authors":"Jeongsub Choi, Youngdoo Son, Jihoon Kang","doi":"10.1109/tsm.2024.3444720","DOIUrl":"https://doi.org/10.1109/tsm.2024.3444720","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"29 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142212254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation 特别版块征稿：通过合成数据生成弥补光伏领域的数据差距
IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Semiconductor Manufacturing
Pub Date : 2024-08-14 DOI: 10.1109/TSM.2024.3442019
{"title":"Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation","authors":"","doi":"10.1109/TSM.2024.3442019","DOIUrl":"https://doi.org/10.1109/TSM.2024.3442019","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 3","pages":"412-413"},"PeriodicalIF":2.3,"publicationDate":"2024-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10636192","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141985946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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