Pub Date : 2024-11-26DOI: 10.1109/TSM.2024.3506312
{"title":"2024 Index IEEE Transactions on Semiconductor Manufacturing Vol. 37","authors":"","doi":"10.1109/TSM.2024.3506312","DOIUrl":"https://doi.org/10.1109/TSM.2024.3506312","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"649-667"},"PeriodicalIF":2.3,"publicationDate":"2024-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10768858","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142713825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3490742
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing","authors":"","doi":"10.1109/TSM.2024.3490742","DOIUrl":"https://doi.org/10.1109/TSM.2024.3490742","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"647-647"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766045","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3455875
{"title":"Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation","authors":"","doi":"10.1109/TSM.2024.3455875","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455875","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"645-646"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765976","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3455873
{"title":"Call for Papers: Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices","authors":"","doi":"10.1109/TSM.2024.3455873","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455873","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"643-644"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766043","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3485049
Oliver D. Patterson;Tomasz Brozek;Kaushik Balamukundhan;David M. Fried;Bill Nehrer;Suresh Ramarajan
{"title":"Guest Editorial Special Section on Sustainability","authors":"Oliver D. Patterson;Tomasz Brozek;Kaushik Balamukundhan;David M. Fried;Bill Nehrer;Suresh Ramarajan","doi":"10.1109/TSM.2024.3485049","DOIUrl":"https://doi.org/10.1109/TSM.2024.3485049","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"418-421"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766050","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142691709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3455877
{"title":"IEEE Transactions on Semiconductor Manufacturing Information for Authors","authors":"","doi":"10.1109/TSM.2024.3455877","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455877","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765978","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-22DOI: 10.1109/TSM.2024.3504213
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TSM.2024.3504213","DOIUrl":"https://doi.org/10.1109/TSM.2024.3504213","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"648-648"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766042","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-11-05DOI: 10.1109/TSM.2024.3483781
Zhao Hong;Chew Ze Yong;Kosasih Lucky;Goh Jun Rong;Wang Joheng
The semiconductor industry faces increasing pressure to improve energy efficiency while maintaining competitiveness and sustainability. Apart from more conventional energy efficiency measures look at equipment modernization and process and design optimization, this paper explores the potential of data-driven approaches to address these challenges and optimize energy consumption across both the facility and manufacturing space of a semiconductor manufacture plant. By harnessing advanced analytics, machine learning algorithms, and IoT technologies, semiconductor manufacturers can gain real-time insights into energy usage patterns, and identify areas of opportunities that leads to the implementation of targeted interventions to optimize performance. The paper first looks into the challenges and measures of enabling and enhancing data visibility which is the foundation of the data-driven approach, then it examines case studies, best practices and various systematic approaches, demonstrating the transformative impact of data-driven energy efficiency measures which leads to operational efficiency, cost reduction, and environmental sustainability. Ultimately, this paper aims to provide a fresh angle into the energy efficiency study for peers in semiconductor industries to leverage in their journey towards a more sustainable and energy efficient future.
{"title":"A Data-Driven Approach for Improving Energy Efficiency in a Semiconductor Manufacturing Plant","authors":"Zhao Hong;Chew Ze Yong;Kosasih Lucky;Goh Jun Rong;Wang Joheng","doi":"10.1109/TSM.2024.3483781","DOIUrl":"https://doi.org/10.1109/TSM.2024.3483781","url":null,"abstract":"The semiconductor industry faces increasing pressure to improve energy efficiency while maintaining competitiveness and sustainability. Apart from more conventional energy efficiency measures look at equipment modernization and process and design optimization, this paper explores the potential of data-driven approaches to address these challenges and optimize energy consumption across both the facility and manufacturing space of a semiconductor manufacture plant. By harnessing advanced analytics, machine learning algorithms, and IoT technologies, semiconductor manufacturers can gain real-time insights into energy usage patterns, and identify areas of opportunities that leads to the implementation of targeted interventions to optimize performance. The paper first looks into the challenges and measures of enabling and enhancing data visibility which is the foundation of the data-driven approach, then it examines case studies, best practices and various systematic approaches, demonstrating the transformative impact of data-driven energy efficiency measures which leads to operational efficiency, cost reduction, and environmental sustainability. Ultimately, this paper aims to provide a fresh angle into the energy efficiency study for peers in semiconductor industries to leverage in their journey towards a more sustainable and energy efficient future.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"475-480"},"PeriodicalIF":2.3,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10742890","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142691763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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