Pub Date : 2024-06-26DOI: 10.1109/tsm.2024.3418520
Xingna Hou, Mulan Yi, Shouhong Chen, Meiqi Liu, Ziren Zhu
{"title":"Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi Path DCNN","authors":"Xingna Hou, Mulan Yi, Shouhong Chen, Meiqi Liu, Ziren Zhu","doi":"10.1109/tsm.2024.3418520","DOIUrl":"https://doi.org/10.1109/tsm.2024.3418520","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141508242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-25DOI: 10.1109/tsm.2024.3418827
Qian Yue, Chen Lan
{"title":"DSH to Extend-DSH: Chip-level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy","authors":"Qian Yue, Chen Lan","doi":"10.1109/tsm.2024.3418827","DOIUrl":"https://doi.org/10.1109/tsm.2024.3418827","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141508244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-24DOI: 10.1109/tsm.2024.3416844
Roberto Dailey, Sam Bertelson, Jinki Kim, Dragan Djurdjanovic
{"title":"Virtual Metrology of Critical Dimensions in Plasma Etch Processes using Entire Optical Emission Spectrum","authors":"Roberto Dailey, Sam Bertelson, Jinki Kim, Dragan Djurdjanovic","doi":"10.1109/tsm.2024.3416844","DOIUrl":"https://doi.org/10.1109/tsm.2024.3416844","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141508241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-21DOI: 10.1109/tsm.2024.3403230
Dongxue Zhao, Zhiliang Xia, Yi Yang, Meiying Liu, Yuancheng Yang, Zongliang Huo
{"title":"Optimization of Void Defects at TiN/Si:HfO2 Interface for 3D Ferroelectric Memory","authors":"Dongxue Zhao, Zhiliang Xia, Yi Yang, Meiying Liu, Yuancheng Yang, Zongliang Huo","doi":"10.1109/tsm.2024.3403230","DOIUrl":"https://doi.org/10.1109/tsm.2024.3403230","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141149772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-20DOI: 10.1109/tsm.2024.3402214
Se Yun Jo, Minsuk Choi, Sang Jeen Hong
{"title":"Plasma Pretreatment System for the Reduction of By-product Particles in Semiconductor Manufacturing","authors":"Se Yun Jo, Minsuk Choi, Sang Jeen Hong","doi":"10.1109/tsm.2024.3402214","DOIUrl":"https://doi.org/10.1109/tsm.2024.3402214","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141149660","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-06DOI: 10.1109/tsm.2024.3396994
Min Ho Kim, Hye Eun Sim, Sang Jeen Hong
{"title":"Part-Level Fault Classification of Mass Flow Controller Drift in Plasma Deposition Equipment","authors":"Min Ho Kim, Hye Eun Sim, Sang Jeen Hong","doi":"10.1109/tsm.2024.3396994","DOIUrl":"https://doi.org/10.1109/tsm.2024.3396994","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140882583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-03DOI: 10.1109/tsm.2024.3396423
Yongwon Jo, Jinsoo Bae, Hansam Cho, Heejoong Roh, Kyunghye Kim, Munki Jo, Jaeung Tae, Seoung Bum Kim
{"title":"Semantic Segmentation for Noisy and Limited Wafer Transmission Electron Microscope Images","authors":"Yongwon Jo, Jinsoo Bae, Hansam Cho, Heejoong Roh, Kyunghye Kim, Munki Jo, Jaeung Tae, Seoung Bum Kim","doi":"10.1109/tsm.2024.3396423","DOIUrl":"https://doi.org/10.1109/tsm.2024.3396423","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140831626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Observation and Suppression of Growth Pits Formed On 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process","authors":"Yoshiaki Daigo, Keisuke Kurashima, Shigeaki Ishii, Ichiro Mizushima","doi":"10.1109/tsm.2024.3395361","DOIUrl":"https://doi.org/10.1109/tsm.2024.3395361","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.7,"publicationDate":"2024-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140831548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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