Alexander Litke , Elahe Zakizade , Marvin Michel , Sascha Weyers , Anna Lena Schall-Giesecke
{"title":"Plasmonic metamaterial absorber for MWIR and LWIR bispectral microbolometers","authors":"Alexander Litke , Elahe Zakizade , Marvin Michel , Sascha Weyers , Anna Lena Schall-Giesecke","doi":"10.1016/j.mne.2024.100262","DOIUrl":null,"url":null,"abstract":"<div><p>Plasmonic metamaterial absorbers (PMAs) designed for multispectral imaging in the infrared (IR) with uncooled microbolometers are investigated. The study presents Fourier transform infrared spectroscopy (FTIR) measurements of PMAs consisting of metal-insulator-metal-stacks (MIM) with square-shaped micropatches as top metal layers. The measurements reveal high absorptances of 82% to 99% for distinct wavelengths within a range from 2 μm to 9.2 μm. The spectra are evaluated with respect to the lateral dimensions of the patches and to the refractive indices of the used dielectrics SiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub> and Ta<sub>2</sub>O<sub>5</sub>. Numerical simulations and analytical calculations of the TM<sub>010</sub>-mode using the transmission line model (TLM) for microstrip antennas show good qualitative agreement with the measurement results. Additionally, bispectral PMAs were fabricated consisting of fields of PMAs with two different patch sizes arranged in a chessboard pattern. The individual fields of this pattern correspond to microbolometers with 12 μm pitch in shape and size. Two distinct absorption maxima can be seen in the spectra measured by FTIR. The choice of materials, deposition methods and patterning processes is suitable for the integration into the existing Fraunhofer IMS's nanotube microbolometer technology to realize multispectral infrared imaging. The fabrication process is CMOS-compatible and carried out on 8-in. wafers.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100262"},"PeriodicalIF":2.8000,"publicationDate":"2024-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S259000722400025X/pdfft?md5=f4203714dbb897b05b563c1db386a14d&pid=1-s2.0-S259000722400025X-main.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micro and Nano Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S259000722400025X","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Plasmonic metamaterial absorbers (PMAs) designed for multispectral imaging in the infrared (IR) with uncooled microbolometers are investigated. The study presents Fourier transform infrared spectroscopy (FTIR) measurements of PMAs consisting of metal-insulator-metal-stacks (MIM) with square-shaped micropatches as top metal layers. The measurements reveal high absorptances of 82% to 99% for distinct wavelengths within a range from 2 μm to 9.2 μm. The spectra are evaluated with respect to the lateral dimensions of the patches and to the refractive indices of the used dielectrics SiO2, Al2O3 and Ta2O5. Numerical simulations and analytical calculations of the TM010-mode using the transmission line model (TLM) for microstrip antennas show good qualitative agreement with the measurement results. Additionally, bispectral PMAs were fabricated consisting of fields of PMAs with two different patch sizes arranged in a chessboard pattern. The individual fields of this pattern correspond to microbolometers with 12 μm pitch in shape and size. Two distinct absorption maxima can be seen in the spectra measured by FTIR. The choice of materials, deposition methods and patterning processes is suitable for the integration into the existing Fraunhofer IMS's nanotube microbolometer technology to realize multispectral infrared imaging. The fabrication process is CMOS-compatible and carried out on 8-in. wafers.