Metal additive manufacturing using powder sheets (MAPS) of HEA CoNiCrFeMn: The effect of the polymer content on microstructure and mechanical properties

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL Cirp Annals-Manufacturing Technology Pub Date : 2024-01-01 DOI:10.1016/j.cirp.2024.04.066
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Abstract

Metal additive using Powder Sheets is an innovative technology driven on eliminating loose powder in laser based additive manufacturing. The utilisation of a novel composite polymer-powder material enables the complete encapsulation of powder to mitigate safety risks and production issues associated with loose powder. This research demonstrates the versatility of this technology through varying the composition of the novel composite material, to deliver stronger, harder and more ductile materials. It is demonstrated that high-entropy-alloys can be printed with better mechanical properties while not altering the solid solution. Future applications arise in the field of multi-materials and coatings.

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使用 HEA CoNiCrFeMn 粉末片材 (MAPS) 进行金属增材制造:聚合物含量对微观结构和机械性能的影响
使用粉末板的金属添加剂是一项创新技术,旨在消除激光添加剂制造中的松散粉末。利用新型聚合物-粉末复合材料可实现对粉末的完全封装,从而降低安全风险以及与松散粉末相关的生产问题。这项研究通过改变新型复合材料的成分,展示了该技术的多功能性,从而提供更强、更硬、更具韧性的材料。研究表明,在不改变固溶体的情况下,打印出的高熵合金具有更好的机械性能。该技术未来将应用于多种材料和涂层领域。
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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