Reconstruction Mechanism of Surface Integrity for Laser Additive Manufactured 316 L Stainless Steel Subjected to Ultrasonic Surface Rolling Process: Numerical Simulation and Experimental Verification
Qingzhong Xu, Xiao Yang, Junjie Liu, Zhihao Qiu, Gen Li
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引用次数: 0
Abstract
The ultrasonic surface rolling process (USRP) is a strengthening process to improve the surface properties and enhance the mechanical performances of metal materials based on severe plastic deformation and high strain rates. In this study, a three-dimensional numerical model was established to investigate the reconstruction mechanism of surface integrity for the laser additive manufactured 316 L stainless steel (LAMed 316 L) subjected to USRP. The accuracy of the USRP model was confirmed by experimental results of residual stress, microhardness, and surface roughness. The results showed that the static pressure played a crucial role in causing the plastic deformation and strain hardening, followed by the decreased surface roughness, improved microhardness, and induced compressive residual stresses. The introduction of ultrasonic high-frequency impact with the smaller force contributed to the high strain rate plastic deformation and the surface tensile stress release, and improved the plastic deformation efficiency greatly. The reconstructed surface integrity of LAMed 316 L was attributed to the plastic strain, strain hardening, and grain refinement.
期刊介绍:
Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.