Soft Magnetic Characteristics and Magnetoimpedance Phenomenon in Copper Wire Coated with Permalloy Film Electroplated from a Sodium Gluconate-Based Bath

IF 2.5 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Materials Pub Date : 2024-05-24 DOI:10.1007/s11664-024-11136-3
Prerit Tandon, Akhila Priya Kotti, Amaresh Chandra Mishra, R. Venkatesh, Kumud Singh, Kavita Srikanti, R. Gopalan
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Abstract

Nanocrystalline NiFe thin films of 11 μm thickness have been deposited on Cu wire using an electrochemical technique in galvanostatic mode with a sodium gluconate (SG) additive in the plating solution. The SG concentration is systematically varied from 0 g/L to 80 g/L, which results in a substantial enhancement in the soft magnetic characteristics and magnetoimpedance (MI) ratio of the plated wire across a broad frequency spectrum, specifically attributed to the optimal inclusion of SG at 55 g/L. The observed improvements in magnetic softness and MI ratio are linked to the reduction in crystalline size and surface roughness and modifications in the microstructure influenced by the SG additive in the electroplating bath. Furthermore, an equivalence between experimental impedance data and the theoretical framework based on the analytical model of circumferential permeability is outlined to extract the material parameters of the permalloy magnetic films. These extracted parameters play a pivotal role, enabling a comprehensive understanding of the variation in the MI ratio as well as circumferential permeability of the thin films as a function of the SG additive concentration in the plating bath. The intricate association observed between the MI ratio and circumferential permeability suggests that the amplification of the MI ratio resulting from the inclusion of SG is linked primarily to enhancements in circumferential permeability and the incorporation of magnetic softness. Thus, the present work offers both a theoretical and experimental framework for future research in advanced MI-based devices for magnetic sensing applications.

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葡萄糖酸钠镀液电镀坡莫合金薄膜铜线的软磁特性和磁阻现象
在恒流模式下,在镀液中加入葡萄糖酸钠(SG),采用电化学技术在铜线上制备了厚度为11 μm的纳米NiFe薄膜。SG浓度系统地从0 g/L变化到80 g/L,这导致镀丝在宽频谱上的软磁特性和磁阻抗(MI)比显著增强,特别是由于在55 g/L时SG的最佳包含。观察到的磁性柔软度和MI比的改善与电镀液中SG添加剂影响的晶体尺寸和表面粗糙度的减小以及微观结构的改变有关。在此基础上,建立了实验阻抗数据与基于周向磁导率解析模型的理论框架之间的等价关系,以提取坡莫合金磁性薄膜的材料参数。这些提取的参数起着关键作用,使我们能够全面了解MI比的变化以及薄膜的周向渗透率作为镀槽中SG添加剂浓度的函数。在磁导率和周向磁导率之间观察到的复杂关系表明,SG包裹导致的磁导率的扩大主要与周向磁导率的增强和磁柔软性的结合有关。因此,目前的工作为未来研究用于磁传感应用的先进的基于mi的设备提供了理论和实验框架。
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来源期刊
Journal of Electronic Materials
Journal of Electronic Materials 工程技术-材料科学:综合
CiteScore
4.10
自引率
4.80%
发文量
693
审稿时长
3.8 months
期刊介绍: The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.
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