Depth profiles of deep levels generated in the tail region of Al ion implantation into n-type 4H-SiC

Haruki Fujii, Mitsuaki Kaneko, Tsunenobu Kimoto
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Abstract

Depth profiles of deep levels in the tail region of Al ion implantation in n-type 4H-SiC were investigated by deep level transient spectroscopy measurements. Deep levels energetically located at Ec – 0.55 eV, Ec – 0.64 eV, and Ec – 1.50 eV (Ec : conduction band bottom) are generated in the tail region by the implantation and subsequent activation annealing at 1750oC for 20 min. The densities of these defects were approximately 20–40 times lower than the implanted Al atom density, and the densities of these defects and Al atoms exhibited an exponential decay along the depth direction with a decay length of 140–190 nm. Another deep level located at Ec – 1.30 eV was detected in the tail region and the density of this trap decreased more rapidly with a decay length of 62 nm. The origins of the observed deep levels are discussed based on several experimental results.
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铝离子植入 n 型 4H-SiC 尾区产生的深电平深度剖面图
通过深电平瞬态光谱测量,研究了铝离子植入 n 型 4H-SiC 尾区深电平的深度剖面。通过植入和随后在 1750 摄氏度下 20 分钟的活化退火,在尾区产生了能量位于 Ec - 0.55 eV、Ec - 0.64 eV 和 Ec - 1.50 eV(Ec:导带底部)的深电平。这些缺陷的密度比植入的铝原子密度低约 20-40 倍,这些缺陷和铝原子的密度沿深度方向呈指数衰减,衰减长度为 140-190 nm。在尾部区域检测到了位于 Ec - 1.30 eV 的另一个深电平,该陷阱的密度衰减得更快,衰减长度为 62 nm。我们根据一些实验结果讨论了观测到的深电平的起源。
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