Effect of recycled swarf and spherical Ti-6Al-4V feedstocks on laser directed energy deposition additive manufacturing

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL Cirp Annals-Manufacturing Technology Pub Date : 2024-01-01 DOI:10.1016/j.cirp.2024.03.013
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Abstract

Feedstock from locally-sourced, recycled Ti-6Al-4V (Ti64) swarf is a low-cost alternative to atomized powder and encourages circular additive manufacturing. This study investigates the feasibility of Ti64 swarf as feedstock for laser directed energy deposition (L-DED) additive manufacturing. Ti64 swarf was recycled and ball-milled into irregular-shaped powder and compared to spherical plasma-atomized powder in powder flow, melt flow, and resulting microstructure. In situ monitoring showed that plasma-atomized powder had laminar flow during deposition and that ball-milled swarf powder had turbulent flow. Plasma-atomized powder caused steady melt pool dynamics and acicular microstructure. Ball-milled swarf powder caused melt pool fluctuation and equiaxed microstructure.

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回收屑和球形 Ti-6Al-4V 原料对激光定向能沉积增材制造的影响
来自本地的回收 Ti-6Al-4V (Ti64) 废料是雾化粉末的低成本替代品,可促进循环增材制造。本研究调查了将 Ti64 下脚料作为激光定向能沉积 (L-DED) 增材制造原料的可行性。将 Ti64 下脚料回收并球磨成不规则形状的粉末,并与球形等离子体雾化粉末在粉末流动、熔体流动和由此产生的微观结构方面进行比较。现场监测显示,等离子体雾化粉末在沉积过程中具有层流流动性,而球磨屑粉具有紊流流动性。等离子体雾化粉末可产生稳定的熔池动态和针状微观结构。球磨碎屑粉末则造成熔池波动和等轴晶微观结构。
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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