Patterned Liquid Micro Rails for the Transport of Micrometer Sized Chips

IF 6.4 3区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Advanced Materials Technologies Pub Date : 2024-05-30 DOI:10.1002/admt.202400235
Pedro H. O. Moreira, Alper K. Soydan, Johannes Reiprich, Nishchay A. Isaac, Bardia Aliabadian, Guilherme J. Vernizzi, Heiko O. Jacobs
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Abstract

Transport and alignment of microscopic chips are important steps in microelectronics component integration with common approaches being pick-and-place, microfluidics, parallel transfer and self-assembly. An alternate transport approach of microscopic chips is proposed using patterned liquid micro rails as chaperones. The surface free energy and interfacial free energy minimization of all constituents enable the creation of stable pathways. This allows for chip-attachment to rails, while the liquid layer lubricates chip-sliding. Monorails, digital monorails, and digital birails are investigated for chip movement behavior. Chip position and speed can be controlled using liquid flow in closed chambers. Speeds from 10 to 400 mm s−1 are achieved with translation distances as long as 50 mm. It is discovered that chips can selectively cross rail discontinuities of up to 500 µm, allowing for chip position control through a stop-and-go motion. A programmable liquid rails-based chip conveyor system is demonstrated by transporting diodes to receptor sites where they undergo self-assembly.

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用于传输微米级芯片的图案化液体微轨
微观芯片的传输和对准是微电子元件集成的重要步骤,常见的方法有拾取-放置、微流体、平行传输和自组装。本文提出了另一种微观芯片传输方法,即使用图案化液体微轨作为陪衬。利用所有成分的表面自由能和界面自由能最小化,可以创建稳定的路径。这样,芯片就能附着在轨道上,而液体层则能润滑芯片滑动。研究了单轨、数字单轨和数字双轨的芯片移动行为。芯片的位置和速度可通过封闭室中的液流进行控制。速度从 10 到 400 mm s-1 不等,平移距离长达 50 mm。研究发现,芯片可以有选择性地穿过长达 500 微米的轨道不连续性,从而可以通过走走停停的运动实现芯片位置控制。通过将二极管传送到受体位置进行自组装,演示了基于液轨的可编程芯片传送系统。
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来源期刊
Advanced Materials Technologies
Advanced Materials Technologies Materials Science-General Materials Science
CiteScore
10.20
自引率
4.40%
发文量
566
期刊介绍: Advanced Materials Technologies Advanced Materials Technologies is the new home for all technology-related materials applications research, with particular focus on advanced device design, fabrication and integration, as well as new technologies based on novel materials. It bridges the gap between fundamental laboratory research and industry.
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