Recovery heat flux at superfluid helium boiling in a U-shape channel with a porous backfill

IF 1.8 3区 工程技术 Q3 PHYSICS, APPLIED Cryogenics Pub Date : 2024-05-31 DOI:10.1016/j.cryogenics.2024.103864
Yu. Yu Puzina, A.P. Kryukov
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Abstract

The paper presents experimental data on the recovery heat flux during the boiling of superfluid helium (He II) on a flat heater located inside a U-shaped channel. The lower part of the channel is filled with monodisperse porous backfill. The paper includes information on the experimental cell, the data processing and synchronization technique, and the results of experiments conducted at different heater immersion depths and liquid temperatures. The paper presents also a mathematical description of heat transfer processes in superfluid helium for confined conditions. The calculated values are compared with experimental data. The effect of the porous backfill permeability on the recovery heat flux, including the case of a free channel is discussed. It is demonstrated that the increase in the heat flux in the channel initiates oscillations of the phase interface.

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带有多孔回填层的 U 型通道中超流体氦沸腾时的恢复热通量
本文介绍了超流体氦(He II)在位于 U 形通道内的平面加热器上沸腾时的回收热通量的实验数据。通道下部填充了单分散多孔回填材料。论文包括有关实验单元、数据处理和同步技术的信息,以及在不同加热器浸入深度和液体温度下进行的实验结果。论文还对封闭条件下超流体氦的传热过程进行了数学描述。计算值与实验数据进行了比较。讨论了多孔回填渗透率对回收热通量的影响,包括自由通道的情况。研究表明,通道中热流的增加会引发相界面的振荡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Cryogenics
Cryogenics 物理-热力学
CiteScore
3.80
自引率
9.50%
发文量
0
审稿时长
2.1 months
期刊介绍: Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are: - Applications of superconductivity: magnets, electronics, devices - Superconductors and their properties - Properties of materials: metals, alloys, composites, polymers, insulations - New applications of cryogenic technology to processes, devices, machinery - Refrigeration and liquefaction technology - Thermodynamics - Fluid properties and fluid mechanics - Heat transfer - Thermometry and measurement science - Cryogenics in medicine - Cryoelectronics
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