Studying the Effect of a Thermocouple Contact with the Surface of a Thin Sample with Low Thermal Conductivity on the Accuracy of Temperature Determination

Abstract

The issue of the actually achieved measurement temperature accuracy of samples of materials used for fabricating printed circuit board bases using the contact method is considered. The purpose of the work is to estimate the error in measuring the temperature of the sample surface caused by the temperature field distortion when a thermocouple probe is brought into contact with the surface. Numerical simulation of the temperature distribution in the sample before and after its contact with the thermocouple probe is carried out. The effect of the thermal conductivity of a sample and the contact area of a thermocouple with the sample on the temperature measurement error is studied. The possibility of increasing the accuracy of temperature measurements by the contact method by introducing a thermal interface in the form of a heat-conducting paste into the contact area is discussed.