Silver and copper screen‐printed temperature sensors on flexible substrates: The impact of ink sintering conditions and composition

Applied Research Pub Date : 2024-06-12 DOI:10.1002/appl.202300138

Celina Vaquero, Leire Bilbao, Ana Pérez, Haizea Villaverde, Jon Maudes, O. Adarraga, Izaskun Bustero, Miren Hayet, Julen Caballero, Ibai Santamaría

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Abstract

Fully screen‐printed silver and copper temperature sensors were studied up to 100°C. The influence of the processing conditions and the composition of three silver and one copper commercial inks is analyzed in this study. The curing temperature is extremely relevant to stabilize the initial resistance of silver sensors, especially for those printed with the lowest solid content ink. All printed sensors showed good linear behavior in the range of 25–100°C (R2 > 0.999) except for those fabricated with the lowest solid content silver ink, which also displayed the highest hysteresis and drift. The temperature coefficient of resistance (TCR) obtained for the copper sensors was 3.367 × 10−3 K−1 and for the three silver sensors, it ranged between 2.723 × 10−3 to 2.963 × 10−3 K−1. This TCR is higher than values reported for inkjet‐printed resistive temperature detectors. Overall, this work demonstrates that low‐cost, linear, screen‐printed temperature sensors can be successfully fabricated on flexible substrates.

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柔性基底上的银和铜丝网印刷温度传感器：油墨烧结条件和成分的影响

研究了温度高达 100°C 的全丝网印刷银温度传感器和铜温度传感器。本研究分析了加工条件以及三种银和一种铜商用油墨成分的影响。固化温度对于稳定银传感器的初始电阻极为重要，特别是对于使用固含量最低的油墨印刷的传感器。在 25-100°C 范围内，所有印刷传感器都表现出良好的线性特性（R2 > 0.999），但使用固含量最低的银油墨制造的传感器除外，这种传感器也表现出最大的滞后和漂移。铜传感器的电阻温度系数（TCR）为 3.367 × 10-3 K-1，三个银传感器的电阻温度系数在 2.723 × 10-3 至 2.963 × 10-3 K-1 之间。这一 TCR 值高于喷墨打印电阻式温度检测器的报告值。总之，这项工作表明，可以在柔性基底上成功制造出低成本、线性丝网印刷温度传感器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Applied Research

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