Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder

IF 2.5 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Materials Pub Date : 2024-06-06 DOI:10.1007/s11664-024-11169-8

Dan Zhang, Haoran Ma, Chong Dong, Tianhao Guo, Haitao Ma, Yunpeng Wang

引用次数: 0

Abstract

In recent years, Sn-Bi solder has been widely used in the electronic packaging industry due to its low melting point. However, the segregation and coarsening of Bi will degrade the mechanical properties of solder joints. In this paper, the shear strength of Sn-Bi/(111)Cu joints is enhanced by refining the distribution of Bi in the composite solder. Bi diffuses in the Sn-Sn58Bi layered composite structure in the reflow process, resulting in inhibition of coarsening. In addition, the growth behavior and orientation of Cu₆Sn₅ in Sn58Bi/(111)Cu and Sn-Sn58Bi/(111)Cu solder joints are also investigated.

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通过细化复合焊料中铋的分布提高锡-铋/(111)铜接头的剪切强度

近年来，锡铋焊料因其熔点低而被广泛应用于电子封装行业。然而，铋的偏析和粗化会降低焊点的力学性能。本文通过细化Bi在复合焊料中的分布，提高了Sn-Bi/(111)Cu接头的抗剪强度。在回流过程中，Bi在Sn-Sn58Bi层状复合结构中扩散，抑制了粗化。此外，还研究了Cu6Sn5在Sn58Bi/(111)Cu和Sn-Sn58Bi/(111)Cu焊点中的生长行为和取向。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Materials 工程技术-材料科学：综合

CiteScore

4.10

自引率

4.80%

发文量

693

审稿时长

3.8 months

期刊介绍： The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.