Direct high-temperature growth of GaN on Si using trimethylaluminum preflow enabling vertically-conducting heterostructures

A. Floriduz, Uiho Choi, E. Matioli
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Abstract

In this work, we demonstrate that GaN can be directly grown at high temperature on Si(111) substrates by metalorganic chemical vapor deposition without using any intentional AlN buffer, by simply employing a trimethylaluminum (TMAl) preflow. We found that n-GaN layers directly grown on n-Si with a TMAl preflow not only present a better crystalline quality compared to the use of thin AlN buffers, but also exhibit orders-of-magnitude improvement in vertical current conduction between GaN and Si, thanks to the absence of highly resistive AlN layers. Our proposed technique opens a new pathway for the effective realization of fully-vertical GaN-on-Si devices.
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利用三甲基铝预流在硅上直接高温生长氮化镓,实现垂直导电异质结构
在这项工作中,我们证明了只需采用三甲基铝 (TMAl) 预流,就可以通过金属有机化学气相沉积法在硅 (111) 基底上直接高温生长氮化镓,而无需使用任何有意的 AlN 缓冲剂。我们发现,与使用薄 AlN 缓冲层相比,使用 TMAl 预流直接在 n-Si 上生长的 n-GaN 层不仅具有更好的结晶质量,而且由于没有高电阻 AlN 层,GaN 和 Si 之间的垂直电流传导也得到了数量级的改善。我们提出的技术为有效实现全垂直硅基氮化镓器件开辟了一条新途径。
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