Monolithic integrated optoelectronic chip for vector force detection.

IF 7.3 1区 工程技术 Q1 INSTRUMENTS & INSTRUMENTATION Microsystems & Nanoengineering Pub Date : 2024-06-24 eCollection Date: 2024-01-01 DOI:10.1038/s41378-024-00712-6
Jiansong Feng, Zhongqi Wang, Mengyuan Zhanghu, Xu Zhang, Yong Shen, Jing Yang, Zhibin Li, Bin Chen, Taihong Wang, Xiaolong Chen, Zhaojun Liu
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Abstract

Sensors with a small footprint and real-time detection capabilities are crucial in robotic surgery and smart wearable equipment. Reducing device footprint while maintaining its high performance is a major challenge and a significant limitation to their development. Here, we proposed a monolithic integrated micro-scale sensor, which can be used for vector force detection. This sensor combines an optical source, four photodetectors, and a hemispherical silicone elastomer component on the same sapphire-based AlGaInP wafer. The chip-scale optical coupling is achieved by employing the laser lift-off techniques and the flip-chip bonding to a processed sapphire substrate. This hemispherical structure device can detect normal and shear forces as low as 1 mN within a measurement range of 0-220 mN for normal force and 0-15 mN for shear force. After packaging, the sensor is capable of detecting forces over a broader range, with measurement capabilities extending up to 10 N for normal forces and 0.2 N for shear forces. It has an accuracy of detecting a minimum normal force of 25 mN and a minimum shear force of 20 mN. Furthermore, this sensor has been validated to have a compact footprint of approximately 1.5 mm2, while maintaining high real-time response. We also demonstrate its promising potential by combining this sensor with fine surface texture perception in the fields of compact medical robot interaction and wearable devices.

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用于矢量力检测的单片集成光电芯片。
在机器人手术和智能可穿戴设备中,占地面积小且具有实时检测能力的传感器至关重要。在保持高性能的同时减少设备的占地面积是一项重大挑战,也是限制其发展的一个重要因素。在此,我们提出了一种可用于矢量力检测的单片集成微尺度传感器。该传感器在同一蓝宝石基 AlGaInP 晶圆上集成了一个光源、四个光电探测器和一个半球形硅弹性元件。芯片级光学耦合是通过采用激光升离技术和倒装芯片键合到加工过的蓝宝石基板上实现的。这种半球形结构的器件可以检测低至 1 mN 的法向力和剪切力,法向力的测量范围为 0-220 mN,剪切力的测量范围为 0-15 mN。封装后,传感器能够检测更大范围的力,法向力测量范围可达 10 N,剪切力测量范围可达 0.2 N。其检测精度为最小法向力 25 mN,最小剪切力 20 mN。此外,经过验证,该传感器的占地面积仅为 1.5 平方毫米,同时还能保持较高的实时响应速度。我们还将该传感器与精细表面纹理感知相结合,在紧凑型医疗机器人交互和可穿戴设备领域展示了它的巨大潜力。
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来源期刊
Microsystems & Nanoengineering
Microsystems & Nanoengineering Materials Science-Materials Science (miscellaneous)
CiteScore
12.00
自引率
3.80%
发文量
123
审稿时长
20 weeks
期刊介绍: Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.
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