Li Liu , Chenru Zhang , Song Du , Zhiwen Chen , Simin Li , Ziwen Chen , Qian Wang , Lingzhu Xie , Changqing Liu
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引用次数: 0
Abstract
Presently, interfacial intermetallic compounds play a vital role in determining the reliability of solder joints due to their intrinsic mechanical property. Especially for Zn–Al solder joints, the interfacial Cu–Zn IMCs grow significantly without diffusion barriers. This work comprehensively investigated the mechanical properties of interfacial IMCs in Zn–Al solder joints with and without the Ni–W–P diffusion barrier by nanoindentation tests and first-principles calculations. The nanoindentation results show that the elastic moduli of CuZn4, Cu5Zn8, CuZn and Al3Ni2 were 68.45 ± 1.4 GPa, 142.6 ± 2.3 GPa, 94.7 ± 1.16 GPa, and 221 ± 18.9 GPa, respectively. Their corresponding hardness were 1.03 ± 0.04 GPa, 5.98 ± 0.23 GPa, 1.38 ± 0.16 GPa, and 17.7 ± 0.16 GPa. Through first-principles calculations, the bulk modulus of CuZn and Cu5Zn8 exhibits isotropic behaviour, while CuZn4 and Al3Ni2 demonstrate anisotropy. In addition, the bulk modulus, shear modulus, Young's modulus and hardness values of Al3Ni2 are considerably higher when compared to those of Cu–Zn intermetallic compounds.
期刊介绍:
This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys.
The journal reports the science and engineering of metallic materials in the following aspects:
Theories and experiments which address the relationship between property and structure in all length scales.
Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations.
Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties.
Technological applications resulting from the understanding of property-structure relationship in materials.
Novel and cutting-edge results warranting rapid communication.
The journal also publishes special issues on selected topics and overviews by invitation only.