In this paper, Cu/Sn-9Zn-30Cu/Cu solder joints were prepared by low-temperature transient liquid phase (TLP) bonding. The effect of bonding temperature on the microstructure, intermetallic compounds (IMCs) growth and shear property of the Cu/Sn-9Zn-30Cu/Cu solder joints was investigated. The results showed the microstructure of the in-situ reaction zone mainly consisted of Cu3(Sn,Zn), Cu6(Sn,Zn)5, Cu particles and Zn-rich phases when the bonding temperature was 260 °C. With increasing bonding temperature, the Cu particles and Zn-rich phases were decreased. The interfacial IMCs were composed of Cu3(Sn,Zn) and Cu6(Sn,Zn)5. The thickness of the interfacial IMCs increased with increasing bonding temperature, while Kirkendall voids were formed at the Cu3(Sn,Zn)/Cu interface. The activation energy of interfacial IMCs was 27.06 kJ/mol. The shear strength of the solder joint reached the maximum value of 17.24 MPa when the bonding temperature increased to 280 °C. When the bonding temperatures were 260 °C and 280 °C, the fracture position of the solder joint was in the in-situ reaction zone. With increasing bonding temperature, the fracture position of the solder joint shifted to the interfacial IMCs, and then returned to the in-situ reaction zone. The fracture mode of all solder joints was brittle fracture.