Rational design of CMUTs with annular electrodes for high ultrasonic emission via ESSE enabled stiffness adjustment

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronic Engineering Pub Date : 2024-06-18 DOI:10.1016/j.mee.2024.112224
Zhikang Li , Shiwang Zhang , Yihe Zhao , Shaohui Qin , Shiyu Bai , Jiawei Yuan , Jie Li , Zixuan Li , Beibei Sun , Qi Ma , Xuan Shi , Zilong Zhao , Zheng Yuan , Hefeng Qin , Min Li , Libo Zhao
{"title":"Rational design of CMUTs with annular electrodes for high ultrasonic emission via ESSE enabled stiffness adjustment","authors":"Zhikang Li ,&nbsp;Shiwang Zhang ,&nbsp;Yihe Zhao ,&nbsp;Shaohui Qin ,&nbsp;Shiyu Bai ,&nbsp;Jiawei Yuan ,&nbsp;Jie Li ,&nbsp;Zixuan Li ,&nbsp;Beibei Sun ,&nbsp;Qi Ma ,&nbsp;Xuan Shi ,&nbsp;Zilong Zhao ,&nbsp;Zheng Yuan ,&nbsp;Hefeng Qin ,&nbsp;Min Li ,&nbsp;Libo Zhao","doi":"10.1016/j.mee.2024.112224","DOIUrl":null,"url":null,"abstract":"<div><p>Capacitive micromechanical ultrasonic transducers (CMUTs) with high transmitting acoustic pressure are in urgent demand in the rapidly growing field of air-coupled and therapeutic ultras ound. However, most current CMUTs can rarely balance the performance improvement and batch fabrication capacity, which severely impedes their practical applications. This paper proposes novel CMUTs with annular electrodes that can implement significant improvement in multiple performances while featuring a simple structure and batch fabrication feasibility. The annular electrode configurated between the membrane edge and center areas can effectively soften the corresponding-area membrane stiffness through electrostatic spring softening effects, and leave the stiffness of the membrane central area unchanged, finally enabling the membrane to produce a piston-like deformation, thus improving average displacement and output acoustic pressure. A finite element method was employed to analyze the effect of annular electrodes on the CMUT main performance. The results demonstrated that the novel structure could achieve prominent enhancement in multiple performances, such as an average to maximum displacement rate of 0.46 (about 0.32 for conventional CMUTs), maximum improvements of 300%, 255%, and 11% in average displacement, acoustic pressure, and electromechanical coupling coefficients compared to those of conventional ones. Deep analyses of the variation of the main performances including acoustic pressure, receiving sensitivity, and collapse voltage suggested that an optimal electrode coverage range of 36% ∼ 55% can be used to achieve relatively high comprehensive performances. Meanwhile, the proposed CMUTs feature a simpler structure and fabrication process in comparison with previous ones, showing great promise in air-coupled and therapeutic ultrasound applications.</p></div>","PeriodicalId":18557,"journal":{"name":"Microelectronic Engineering","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2024-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167931724000935","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Capacitive micromechanical ultrasonic transducers (CMUTs) with high transmitting acoustic pressure are in urgent demand in the rapidly growing field of air-coupled and therapeutic ultras ound. However, most current CMUTs can rarely balance the performance improvement and batch fabrication capacity, which severely impedes their practical applications. This paper proposes novel CMUTs with annular electrodes that can implement significant improvement in multiple performances while featuring a simple structure and batch fabrication feasibility. The annular electrode configurated between the membrane edge and center areas can effectively soften the corresponding-area membrane stiffness through electrostatic spring softening effects, and leave the stiffness of the membrane central area unchanged, finally enabling the membrane to produce a piston-like deformation, thus improving average displacement and output acoustic pressure. A finite element method was employed to analyze the effect of annular electrodes on the CMUT main performance. The results demonstrated that the novel structure could achieve prominent enhancement in multiple performances, such as an average to maximum displacement rate of 0.46 (about 0.32 for conventional CMUTs), maximum improvements of 300%, 255%, and 11% in average displacement, acoustic pressure, and electromechanical coupling coefficients compared to those of conventional ones. Deep analyses of the variation of the main performances including acoustic pressure, receiving sensitivity, and collapse voltage suggested that an optimal electrode coverage range of 36% ∼ 55% can be used to achieve relatively high comprehensive performances. Meanwhile, the proposed CMUTs feature a simpler structure and fabrication process in comparison with previous ones, showing great promise in air-coupled and therapeutic ultrasound applications.

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
通过调整 ESSE 的硬度,合理设计带有环形电极的 CMUT,实现高超声波发射
在快速发展的空气耦合和治疗超声领域,迫切需要具有高传输声压的电容式微机械超声换能器(CMUT)。然而,目前大多数 CMUT 很少能在提高性能和批量制造能力之间取得平衡,这严重阻碍了它们的实际应用。本文提出了新型环形电极 CMUT,可显著提高多种性能,同时具有结构简单和批量制造的可行性。配置在膜边缘和中心区域之间的环形电极可通过静电弹簧软化效应有效软化相应区域的膜刚度,并使膜中心区域的刚度保持不变,最终使膜产生活塞式变形,从而提高平均位移和输出声压。研究人员采用有限元法分析了环形电极对 CMUT 主要性能的影响。结果表明,这种新型结构能显著提高多种性能,如平均到最大位移率为 0.46(传统 CMUT 约为 0.32),平均位移、声压和机电耦合系数与传统 CMUT 相比最大分别提高了 300%、255% 和 11%。对声压、接收灵敏度和塌陷电压等主要性能变化的深入分析表明,最佳电极覆盖范围为 36% ∼ 55%,可实现较高的综合性能。同时,与之前的产品相比,所提出的 CMUT 具有结构和制造工艺更简单的特点,在空气耦合和治疗超声应用中大有可为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
期刊最新文献
Editorial Board High density nanofluidic channels by self-sealing for metallic nanoparticles detection Etch of nano-TSV with smooth sidewall and excellent selection ratio for backside power delivery network Development of an emulator of the sustainable energy harvesting pad system on a bike lane for charging lithium batteries Wide scan angle multibeam conformal antenna array with novel feeding for mm-wave 5G applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1