Total third-degree variation for noise reduction in atomic-resolution STEM images.

Kazuaki Kawahara, Ryo Ishikawa, Shun Sasano, Naoya Shibata, Yuichi Ikuhara
{"title":"Total third-degree variation for noise reduction in atomic-resolution STEM images.","authors":"Kazuaki Kawahara, Ryo Ishikawa, Shun Sasano, Naoya Shibata, Yuichi Ikuhara","doi":"10.1093/jmicro/dfae031","DOIUrl":null,"url":null,"abstract":"<p><p>Scanning Transmission Electron Microscopy (STEM) enables direct determination of atomic arrangements in materials and devices. However, materials such as battery components are weak for electron beam irradiation, and low electron doses are required to prevent beam-induced damages. Noise removal is thus essential for precise structural analysis of electron-beam-sensitive materials at atomic resolution. Total square variation (TSV) regularization is an algorithm that exhibits high noise removal performance. However, the use of the TSV regularization term leads to significant image blurring and intensity reduction. To address these problems, we here propose a new approach adopting L2 norm regularization based on higher-order total variation. An atomic-resolution STEM image can be approximated as a set of smooth curves represented by quadratic functions. Since the third-degree derivative of any quadratic function is 0, total third-degree variation (TTDV) is suitable for a regularization term. The application of TTDV for denoising the atomic-resolution STEM image of CaF2 observed along the [001] zone axis is shown, where we can clearly see the Ca and F atomic columns without compromising image quality.</p>","PeriodicalId":74193,"journal":{"name":"Microscopy (Oxford, England)","volume":" ","pages":"1-9"},"PeriodicalIF":0.0000,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microscopy (Oxford, England)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1093/jmicro/dfae031","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Scanning Transmission Electron Microscopy (STEM) enables direct determination of atomic arrangements in materials and devices. However, materials such as battery components are weak for electron beam irradiation, and low electron doses are required to prevent beam-induced damages. Noise removal is thus essential for precise structural analysis of electron-beam-sensitive materials at atomic resolution. Total square variation (TSV) regularization is an algorithm that exhibits high noise removal performance. However, the use of the TSV regularization term leads to significant image blurring and intensity reduction. To address these problems, we here propose a new approach adopting L2 norm regularization based on higher-order total variation. An atomic-resolution STEM image can be approximated as a set of smooth curves represented by quadratic functions. Since the third-degree derivative of any quadratic function is 0, total third-degree variation (TTDV) is suitable for a regularization term. The application of TTDV for denoising the atomic-resolution STEM image of CaF2 observed along the [001] zone axis is shown, where we can clearly see the Ca and F atomic columns without compromising image quality.

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用于原子分辨率 STEM 图像降噪的总三度变异。
扫描透射电子显微镜(STEM)可直接测定材料和设备中的原子排列。然而,电池组件等材料对电子束辐照的耐受性较弱,需要较低的电子剂量以防止电子束引起的损坏。因此,要以原子分辨率对电子束敏感材料进行精确的结构分析,必须去除噪声。总平方变异(TSV)正则化是一种具有高去噪性能的算法。然而,使用 TSV 正则化项会导致图像严重模糊和强度降低。为了解决这些问题,我们在此提出了一种基于高阶总变化的 L2 规范正则化新方法。原子分辨率 STEM 图像可近似为一组由二次函数表示的平滑曲线。由于任何二次函数的三阶导数都是 0,因此总三阶变异(TTDV)适合作为正则化项。图中显示了应用 TTDV 对沿 [001] 区轴线观察到的 CaF2 原子分辨率 STEM 图像进行去噪的情况,在不影响图像质量的情况下,我们可以清楚地看到 Ca 和 F 原子列。
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