Vikrant Singh, Dileep Pathote, Dheeraj Jaiswal, Kamalesh K. Singh, C. K. Behera
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Abstract
The ultimate objective of this study is to find a way to replace toxic lead-based solder with a non-toxic replacement that retains all of the desirable characteristics of the conventional solder. In this work, the integral and partial enthalpy of mixing for Sn–Ga–In ternary alloy systems were measured by the help of drop calorimeter along six of the cross sections at different temperatures of 673 K, 723 K and 773 K. Pieces of pure tin were dropped into molten Ga0.25In0.75, Ga0.50In0.50, Ga0.75In0.25 alloys and pieces of pure Indium into Ga0.25Sn0.75, Ga0.50Sn0.50, Ga0.75Sn0.25. In order to calculate the interaction parameter, Redlich–Kister–Muggianu (RKM) model was used which considers the substitutional solution mechanism. Geometric models i.e. Kohler, Muggianu, Chou, Toop, and Hillert have been used to determine the integral mixing enthalpies and compared with experimental data. It has been seen a good agreement between the theoretical models and results of this study.
期刊介绍：
Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.
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