Cu–CoNiFe multilayered stack for low- and intermediate-frequency magnetic shielding

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Materials Research Pub Date : 2024-06-25 DOI:10.1557/s43578-024-01377-7
Ghaleb Saleh Ghaleb Al-Duhni, Veeru Jaiswal, Mudit Khasgiwala, John L. Volakis, Markondeya Raj Pulugurtha
{"title":"Cu–CoNiFe multilayered stack for low- and intermediate-frequency magnetic shielding","authors":"Ghaleb Saleh Ghaleb Al-Duhni, Veeru Jaiswal, Mudit Khasgiwala, John L. Volakis, Markondeya Raj Pulugurtha","doi":"10.1557/s43578-024-01377-7","DOIUrl":null,"url":null,"abstract":"<p>Electromagnetic interference (EMI) shielding has been a fundamental challenge because of the low wave impedances with monolithic metallic shields at low frequencies. Multilayered structures are considered an alternative to traditional monolithic shielding materials. This paper investigates such multilayered conductors of cobalt–nickel–iron alloy (CoNiFe) and copper (Cu) to illustrate their superiority over conventional monolithic shields. Modeling, simulations, and measurements demonstrate improved shielding when multilayered stacks are used against magnetic field sources. Furthermore, the stack-ups have excellent shielding even with a thickness of 5 µm. At least 40 dB of additional shielding effectiveness is achieved across 30–1000 MHz as compared to single-layer shielding from monolithic Cu of the same thickness. These innovative stack-ups also exhibit superior shielding when compared to multilayered stacks and shielding materials in literature. Additionally, these stack-ups are fabricated using standard substrate processes such as electroplating. Consequently, this approach becomes commercially viable and applicable to future electronic systems.</p><h3 data-test=\"abstract-sub-heading\">Graphical abstract</h3>\n","PeriodicalId":16306,"journal":{"name":"Journal of Materials Research","volume":"10 1","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Research","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43578-024-01377-7","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
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Abstract

Electromagnetic interference (EMI) shielding has been a fundamental challenge because of the low wave impedances with monolithic metallic shields at low frequencies. Multilayered structures are considered an alternative to traditional monolithic shielding materials. This paper investigates such multilayered conductors of cobalt–nickel–iron alloy (CoNiFe) and copper (Cu) to illustrate their superiority over conventional monolithic shields. Modeling, simulations, and measurements demonstrate improved shielding when multilayered stacks are used against magnetic field sources. Furthermore, the stack-ups have excellent shielding even with a thickness of 5 µm. At least 40 dB of additional shielding effectiveness is achieved across 30–1000 MHz as compared to single-layer shielding from monolithic Cu of the same thickness. These innovative stack-ups also exhibit superior shielding when compared to multilayered stacks and shielding materials in literature. Additionally, these stack-ups are fabricated using standard substrate processes such as electroplating. Consequently, this approach becomes commercially viable and applicable to future electronic systems.

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用于低频和中频磁屏蔽的铜-钴-镍-铁多层叠片
电磁干扰(EMI)屏蔽一直是一项基本挑战,因为在低频下,单片金属屏蔽的波阻抗较低。多层结构被认为是传统单片屏蔽材料的替代品。本文研究了这种由钴镍铁合金(CoNiFe)和铜(Cu)组成的多层导体,以说明其优于传统的单片屏蔽材料。建模、模拟和测量结果表明,当使用多层叠层对磁场源进行屏蔽时,屏蔽效果会得到改善。此外,即使厚度为 5 微米,叠层屏蔽效果也非常出色。与相同厚度的单片铜的单层屏蔽相比,在 30-1000 兆赫范围内至少增加了 40 分贝的屏蔽效果。与文献中的多层叠层和屏蔽材料相比,这些创新叠层也显示出卓越的屏蔽效果。此外,这些叠层还可使用电镀等标准基底工艺制作。因此,这种方法具有商业可行性,适用于未来的电子系统。
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来源期刊
Journal of Materials Research
Journal of Materials Research 工程技术-材料科学:综合
CiteScore
4.50
自引率
3.70%
发文量
362
审稿时长
2.8 months
期刊介绍: Journal of Materials Research (JMR) publishes the latest advances about the creation of new materials and materials with novel functionalities, fundamental understanding of processes that control the response of materials, and development of materials with significant performance improvements relative to state of the art materials. JMR welcomes papers that highlight novel processing techniques, the application and development of new analytical tools, and interpretation of fundamental materials science to achieve enhanced materials properties and uses. Materials research papers in the following topical areas are welcome. • Novel materials discovery • Electronic, photonic and magnetic materials • Energy Conversion and storage materials • New thermal and structural materials • Soft materials • Biomaterials and related topics • Nanoscale science and technology • Advances in materials characterization methods and techniques • Computational materials science, modeling and theory
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