Ghaleb Saleh Ghaleb Al-Duhni, Veeru Jaiswal, Mudit Khasgiwala, John L. Volakis, Markondeya Raj Pulugurtha
{"title":"Cu–CoNiFe multilayered stack for low- and intermediate-frequency magnetic shielding","authors":"Ghaleb Saleh Ghaleb Al-Duhni, Veeru Jaiswal, Mudit Khasgiwala, John L. Volakis, Markondeya Raj Pulugurtha","doi":"10.1557/s43578-024-01377-7","DOIUrl":null,"url":null,"abstract":"<p>Electromagnetic interference (EMI) shielding has been a fundamental challenge because of the low wave impedances with monolithic metallic shields at low frequencies. Multilayered structures are considered an alternative to traditional monolithic shielding materials. This paper investigates such multilayered conductors of cobalt–nickel–iron alloy (CoNiFe) and copper (Cu) to illustrate their superiority over conventional monolithic shields. Modeling, simulations, and measurements demonstrate improved shielding when multilayered stacks are used against magnetic field sources. Furthermore, the stack-ups have excellent shielding even with a thickness of 5 µm. At least 40 dB of additional shielding effectiveness is achieved across 30–1000 MHz as compared to single-layer shielding from monolithic Cu of the same thickness. These innovative stack-ups also exhibit superior shielding when compared to multilayered stacks and shielding materials in literature. Additionally, these stack-ups are fabricated using standard substrate processes such as electroplating. Consequently, this approach becomes commercially viable and applicable to future electronic systems.</p><h3 data-test=\"abstract-sub-heading\">Graphical abstract</h3>\n","PeriodicalId":16306,"journal":{"name":"Journal of Materials Research","volume":"10 1","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Research","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43578-024-01377-7","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Electromagnetic interference (EMI) shielding has been a fundamental challenge because of the low wave impedances with monolithic metallic shields at low frequencies. Multilayered structures are considered an alternative to traditional monolithic shielding materials. This paper investigates such multilayered conductors of cobalt–nickel–iron alloy (CoNiFe) and copper (Cu) to illustrate their superiority over conventional monolithic shields. Modeling, simulations, and measurements demonstrate improved shielding when multilayered stacks are used against magnetic field sources. Furthermore, the stack-ups have excellent shielding even with a thickness of 5 µm. At least 40 dB of additional shielding effectiveness is achieved across 30–1000 MHz as compared to single-layer shielding from monolithic Cu of the same thickness. These innovative stack-ups also exhibit superior shielding when compared to multilayered stacks and shielding materials in literature. Additionally, these stack-ups are fabricated using standard substrate processes such as electroplating. Consequently, this approach becomes commercially viable and applicable to future electronic systems.
期刊介绍:
Journal of Materials Research (JMR) publishes the latest advances about the creation of new materials and materials with novel functionalities, fundamental understanding of processes that control the response of materials, and development of materials with significant performance improvements relative to state of the art materials. JMR welcomes papers that highlight novel processing techniques, the application and development of new analytical tools, and interpretation of fundamental materials science to achieve enhanced materials properties and uses. Materials research papers in the following topical areas are welcome.
• Novel materials discovery
• Electronic, photonic and magnetic materials
• Energy Conversion and storage materials
• New thermal and structural materials
• Soft materials
• Biomaterials and related topics
• Nanoscale science and technology
• Advances in materials characterization methods and techniques
• Computational materials science, modeling and theory