IC Phone Home!

IF 1.9 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Design & Test Pub Date : 2024-06-20 DOI:10.1109/mdat.2024.3393829
Scott Davidson
{"title":"IC Phone Home!","authors":"Scott Davidson","doi":"10.1109/mdat.2024.3393829","DOIUrl":null,"url":null,"abstract":"Many who have worked for vertically integrated companies making both ICs and computer equipment have experience in tracking ICs in the field. This is the subject of this issue of <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Design&amp;Test</i> on Silicon Lifecycle Management. If your company dealt with high-end equipment, where every failure mattered, you could close the loop on IC quality and see the failure rate of parts in use.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mdat.2024.3393829","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

Abstract

Many who have worked for vertically integrated companies making both ICs and computer equipment have experience in tracking ICs in the field. This is the subject of this issue of IEEE Design&Test on Silicon Lifecycle Management. If your company dealt with high-end equipment, where every failure mattered, you could close the loop on IC quality and see the failure rate of parts in use.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
IC 电话主页!
许多在生产集成电路和计算机设备的垂直一体化公司工作过的人都有在现场跟踪集成电路的经验。这就是本期 IEEE Design&Test 关于硅生命周期管理的主题。如果您的公司经营的是高端设备,每一个故障都很重要,那么您就可以对集成电路质量进行闭环管理,了解正在使用的部件的故障率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE Design & Test
IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.80
自引率
5.00%
发文量
98
期刊介绍: IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.
期刊最新文献
Silicon Lifecycle Management (SLM): Requirements, Trends, and Opportunities Exploring Resilience of LPDRAM against RowHammer Interview With Vishwani Agrawal IEEE Design & Test Publication Information DATE 2024: Consolidating the New Conference Format
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1