Development of single-component epoxy resin with superb thermal stability, flame retardancy, smoke suppression, and latency via Cu-based phosphorus/imidazole-containing complex

IF 6.3 2区化学 Q1 POLYMER SCIENCE Polymer Degradation and Stability Pub Date : 2024-06-29 DOI:10.1016/j.polymdegradstab.2024.110906

Jingsheng Wang , Jun Wang , Shuang Yang , Chaoqun Wu , Xi Chen , Kaiwen Chen , Pingan Song , Hao Wang , Siqi Huo

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Abstract

To address the growing need for fire-safe single-component epoxy resin (EP) systems, this study introduced a phosphorus-containing copper complex (Cu-DA) as a multifunctional latent curing agent. The Cu-DA complex, synthesized by coordinating copper (II) chloride and a phosphorus-based imidazole, significantly improved the latency, thermal stability, and fire resistance of single-component EP. The obtained EP/Cu-DA-2 mixture with 15.3 wt% Cu-DA showed a 43-day shelf life and a rapid gel time of 22 min at 150 °C, highlighting its superb latency and fast curing. After curing, the resultant thermoset had a high glass transition temperature of 160.9 °C and increased crosslinking density, indicating superior thermal stability. The EP/Cu-DA-3 system with 17.4 wt% Cu-DA achieved a high limiting oxygen index (LOI) of 37.8 % and a UL-94 V-0 rating, reflecting its satisfactory flame retardancy. Furthermore, compared to the control EP system, the total smoke production (TSP) and maximum smoke density (MSD) of EP/Cu-DA-3 were reduced by approximately 28.4 % and 25.8 %, respectively, demonstrating significantly enhanced smoke suppression. The research offers a scalable strategy for developing single-component EP systems with rapid curing, high fire resistance, and great smoke suppression, meeting the demands of industrial applications.

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通过含铜基磷/咪唑复合物，开发出具有超强热稳定性、阻燃性、抑烟性和潜伏性的单组分环氧树脂

为了满足对防火安全的单组分环氧树脂（EP）体系日益增长的需求，本研究引入了一种含磷铜络合物（Cu-DA）作为多功能潜伏固化剂。Cu-DA 复合物由氯化铜 (II) 和磷基咪唑配位合成，能显著改善单组分 EP 的潜伏期、热稳定性和耐火性。所获得的 EP/Cu-DA-2 混合物（Cu-DA 含量为 15.3 wt%）的保质期为 43 天，在 150 °C 下的快速凝胶时间为 22 分钟，显示出其卓越的潜伏性和快速固化性。固化后，所得热固性材料的玻璃化转变温度高达 160.9 ℃，交联密度也有所提高，这表明该材料具有极佳的热稳定性。含 17.4 wt% Cu-DA 的 EP/Cu-DA-3 系统的极限氧指数（LOI）高达 37.8%，并达到了 UL-94 V-0 级，反映出其令人满意的阻燃性。此外，与对照 EP 系统相比，EP/Cu-DA-3 的总产烟量（TSP）和最大烟密度（MSD）分别降低了约 28.4% 和 25.8%，表明烟雾抑制能力显著增强。这项研究为开发具有快速固化、高耐火性和强抑烟性的单组分 EP 系统提供了一种可扩展的策略，可满足工业应用的需求。

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来源期刊

Polymer Degradation and Stability 化学-高分子科学

CiteScore

10.10

自引率

10.20%

发文量

325

审稿时长

23 days

期刊介绍： Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology. Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal. However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.