To address the growing need for fire-safe single-component epoxy resin (EP) systems, this study introduced a phosphorus-containing copper complex (Cu-DA) as a multifunctional latent curing agent. The Cu-DA complex, synthesized by coordinating copper (II) chloride and a phosphorus-based imidazole, significantly improved the latency, thermal stability, and fire resistance of single-component EP. The obtained EP/Cu-DA-2 mixture with 15.3 wt% Cu-DA showed a 43-day shelf life and a rapid gel time of 22 min at 150 °C, highlighting its superb latency and fast curing. After curing, the resultant thermoset had a high glass transition temperature of 160.9 °C and increased crosslinking density, indicating superior thermal stability. The EP/Cu-DA-3 system with 17.4 wt% Cu-DA achieved a high limiting oxygen index (LOI) of 37.8 % and a UL-94 V-0 rating, reflecting its satisfactory flame retardancy. Furthermore, compared to the control EP system, the total smoke production (TSP) and maximum smoke density (MSD) of EP/Cu-DA-3 were reduced by approximately 28.4 % and 25.8 %, respectively, demonstrating significantly enhanced smoke suppression. The research offers a scalable strategy for developing single-component EP systems with rapid curing, high fire resistance, and great smoke suppression, meeting the demands of industrial applications.