Wearable thermoelectric cooler encapsulated with low thermal conductivity filler and honeycomb structure for high cooling effect

IF 10 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Today Physics Pub Date : 2024-06-29 DOI:10.1016/j.mtphys.2024.101491
Yangfan Gao , Sijing Zhu , Jie Gao , Lei Miao , Fen Xu , Lixian Sun
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Abstract

Thermoelectric coolers (TEC) based on Peltier effect has been widely used in small scale cold storage because of its zero emission, and high efficiency, while wearable thermoelectric coolers (WTEC) for personal temperature management is garnered tremendous scientific attention. For out-of-plane structured WTEC using inorganic TE materials encapsuled in flexibility substrate, on the one hand, encapsulating materials are required to have low thermal conductivity, high reliability and high flexibility, and on the other hand, heat dissipation of devices is required to be lightweight, portable and efficient. For this reason, we propose a composite material synthesised from SiO2 aerogel, hollow glass beads (HGB) and polydimethylsiloxane (PDMS) as a filler, which takes advantage of the low thermal conductivity of (0.094 W/mK) to increase the temperature difference in the encapsulation layer of the device, and moreover performs the fabrication of honeycomb holes, which further reduces the thermal conductivity of the encapsulation layer and at the same time brings a certain degree of compression resistance to the device. Radiative cooling (RC) films synthesised using hexagonal boron nitride (HBN) and PDMS for lowering the temperature of the hot side in outdoor environments without additional energy consumption, providing heat dissipation at the hot side. Honeycomb wearable thermoelectric cooler (HWTEC) proposed in this work deliver high cooling temperature difference of 9.1 °C and 6.5 °C indoor and outdoor through human wear. Our work represents an important step in the development of flexible TE devices and is believed to have promising future applications in personal thermal management, e-skin and smart textiles.

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采用低导热填料和蜂窝结构封装的可穿戴式半导体致冷片,冷却效果极佳
基于珀尔帖效应的热电半导体制冷片(TEC)因其零排放和高效率而被广泛应用于小型冷库,而用于个人温度管理的可穿戴式热电半导体制冷片(WTEC)则受到了科学界的极大关注。对于使用封装在柔性衬底中的无机 TE 材料的面外结构 WTEC,一方面要求封装材料具有低导热率、高可靠性和高柔性,另一方面要求器件的散热轻便、便携和高效。为此,我们提出了一种由二氧化硅气凝胶、空心玻璃微珠(HGB)和聚二甲基硅氧烷(PDMS)作为填料合成的复合材料,利用其导热系数低(0.094 W/mK)的特点来增加器件封装层的温差,并通过制作蜂窝孔进一步降低封装层的导热系数,同时为器件带来一定的抗压性。利用六方氮化硼(HBN)和 PDMS 合成的辐射冷却(RC)薄膜,可在不消耗额外能量的情况下降低室外环境中的热侧温度,并提供热侧散热。本研究提出的蜂窝状可穿戴热电冷却器(HWTEC)可通过人体穿戴实现室内外 9.1 ℃ 和 6.5 ℃ 的高冷却温差。我们的工作代表了柔性热电半导体器件发展的重要一步,相信未来在个人热管理、电子皮肤和智能纺织品方面的应用前景广阔。
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来源期刊
Materials Today Physics
Materials Today Physics Materials Science-General Materials Science
CiteScore
14.00
自引率
7.80%
发文量
284
审稿时长
15 days
期刊介绍: Materials Today Physics is a multi-disciplinary journal focused on the physics of materials, encompassing both the physical properties and materials synthesis. Operating at the interface of physics and materials science, this journal covers one of the largest and most dynamic fields within physical science. The forefront research in materials physics is driving advancements in new materials, uncovering new physics, and fostering novel applications at an unprecedented pace.
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