Wearable e-Bandage with Antimicrobial Ionogel as an Integrated Electroceutical Device for Accelerated Wound Healing

IF 9.6 1区化学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY ACS Materials Letters Pub Date : 2024-07-03 DOI:10.1021/acsmaterialslett.4c00920

Bibrita Bhar, Rajan Singh, Vaishak Kundudi Ramesh, Souradeep Dey, Samit K. Nandi, Roy Paily, Biman B. Mandal

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Abstract

Skin wound healing is a highly orchestrated and complex dynamic process, presenting a significant healthcare challenge when its natural progression is interrupted. Despite the known effectiveness of electrical stimulation (ES) in aiding wound recovery, its practical application remains limited by the use of large complicated equipment. Here, we present a miniaturized wearable electroceutical platform (WEP) that generates low-intensity electrical pulses, which are transmitted to the wound site via a breathable electrical bandage patch through a silk-based antimicrobial ionogel interface. In vivo efficacy assessment of WEP demonstrated a significantly rapid wound closure. Histological and immunostaining analysis exhibited accelerated granulation tissue formation, extracellular matrix (ECM) remodeling, and re-epithelization in the presence of pulsed ES. In vitro studies showed ES-facilitated changes in fibroblast response, including proliferation, alignment, and ECM secretion, which potentially contributed to the observed improvements in the healing process. The developed WEP possesses great translational potential, offering an advanced cost-effective therapeutic solution for wound care.

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带有抗菌离子凝胶的可穿戴电子绷带是一种用于加速伤口愈合的集成电疗设备

皮肤伤口愈合是一个高度协调和复杂的动态过程，一旦其自然进展被打断，就会给医疗保健带来巨大挑战。尽管电刺激（ES）在帮助伤口愈合方面的功效众所周知，但其实际应用仍受到大型复杂设备的限制。在这里，我们展示了一种小型化的可穿戴电疗平台（WEP），它能产生低强度的电脉冲，并通过透气电绷带贴片经由丝基抗菌离子凝胶界面传输到伤口部位。WEP 的体内疗效评估显示，伤口闭合速度明显加快。组织学和免疫染色分析表明，在脉冲 ES 的作用下，肉芽组织形成、细胞外基质（ECM）重塑和重新上皮的速度加快。体外研究显示，ES 促进了成纤维细胞反应的变化，包括增殖、排列和 ECM 分泌，这可能是观察到的愈合过程改善的原因。所开发的 WEP 具有巨大的转化潜力，为伤口护理提供了一种先进的、具有成本效益的治疗方案。

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来源期刊

ACS Materials Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

14.60

自引率

3.50%

发文量

261

期刊介绍： ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.