Nonlinear behaviors in back-gate effects of FDSOI MOSFETs at cryogenic temperatures

IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Semiconductor Science and Technology Pub Date : 2024-07-11 DOI:10.1088/1361-6641/ad5e17
Yibo Hu, Zhipeng Ren, Yizhe Yin and Jing Chen
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Abstract

In this work, we systematically investigate the DC performance of fully depleted silicon-on-insulator (FD-SOI) MOSFETs at both room and cryogenic temperatures as low as 77 K. The influences of back-gate bias on normal and flip-well devices are measured and analyzed. Both types devices display non-linear behaviors when adjusting the back-gate voltage at cryogenic temperatures. Notably, the non-linear effects are more prominent in normal-well devices. The possible reasons are analyzed and verified by technology computer aided design simulation, suggesting that normal-well devices are more susceptible to the formation of depletion regions between the buried oxide layer and the well. This phenomenon disrupts the linearity of the back-gate effect. This research contributes to understanding and characterizing of the back-gate effects in cryogenic environments and holds potential for high-performance computing applications.
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低温条件下 FDSOI MOSFET 背栅效应的非线性行为
在这项工作中,我们系统地研究了全耗尽型硅绝缘体(FD-SOI)MOSFET 在室温和低至 77 K 的低温条件下的直流性能。在低温条件下调节后栅极电压时,这两种器件都显示出非线性行为。值得注意的是,非线性效应在正常阱器件中更为突出。通过计算机辅助设计模拟技术分析和验证了可能的原因,认为正常阱器件更容易在埋入氧化层和阱之间形成耗尽区。这种现象破坏了背栅效应的线性。这项研究有助于理解和描述低温环境中的背栅效应,并为高性能计算应用提供了潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Semiconductor Science and Technology
Semiconductor Science and Technology 工程技术-材料科学:综合
CiteScore
4.30
自引率
5.30%
发文量
216
审稿时长
2.4 months
期刊介绍: Devoted to semiconductor research, Semiconductor Science and Technology''s multidisciplinary approach reflects the far-reaching nature of this topic. The scope of the journal covers fundamental and applied experimental and theoretical studies of the properties of non-organic, organic and oxide semiconductors, their interfaces and devices, including: fundamental properties materials and nanostructures devices and applications fabrication and processing new analytical techniques simulation emerging fields: materials and devices for quantum technologies hybrid structures and devices 2D and topological materials metamaterials semiconductors for energy flexible electronics.
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