{"title":"Compact low-loss diplexer with stacked 2D and 3D structures using 3D glass-based advanced packaging technology","authors":"","doi":"10.1016/j.aeue.2024.155425","DOIUrl":null,"url":null,"abstract":"<div><p>A compact low loss wideband diplexer is introduced by using stacked 2D and 3D structures through 3D advanced packaging and through glass vias (TGV). An inductor is designed by using stacked 2D and 3D structures to reduce the coupling effect between adjacent 2D inductors located in the same layer. It can greatly improve the Q factor yet minimize the chip size. This low loss, small size diplexer is developed by virtue of a modified topology and the proposed stacked 2D and 3D structures. The designed diplexer with a compact size of 1.6 mm × 0.8 mm × 0.25 mm is fabricated using 3D glass-based advanced packaging technology and measured by on-wafer probing. The measured results indicate that it achieves an insertion loss less than 0.8 dB and 0.9 dB and an isolation better than 20 dB and 17.5 dB in the bands of 0.699 GHz-0.960 GHz and 1.71 GHz-2.69 GHz, respectively. In comparison with the previously reported designs, the proposed diplexer shows the superior advantages of smaller size and lower insertion loss.</p></div>","PeriodicalId":50844,"journal":{"name":"Aeu-International Journal of Electronics and Communications","volume":null,"pages":null},"PeriodicalIF":3.0000,"publicationDate":"2024-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Aeu-International Journal of Electronics and Communications","FirstCategoryId":"94","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S143484112400311X","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
A compact low loss wideband diplexer is introduced by using stacked 2D and 3D structures through 3D advanced packaging and through glass vias (TGV). An inductor is designed by using stacked 2D and 3D structures to reduce the coupling effect between adjacent 2D inductors located in the same layer. It can greatly improve the Q factor yet minimize the chip size. This low loss, small size diplexer is developed by virtue of a modified topology and the proposed stacked 2D and 3D structures. The designed diplexer with a compact size of 1.6 mm × 0.8 mm × 0.25 mm is fabricated using 3D glass-based advanced packaging technology and measured by on-wafer probing. The measured results indicate that it achieves an insertion loss less than 0.8 dB and 0.9 dB and an isolation better than 20 dB and 17.5 dB in the bands of 0.699 GHz-0.960 GHz and 1.71 GHz-2.69 GHz, respectively. In comparison with the previously reported designs, the proposed diplexer shows the superior advantages of smaller size and lower insertion loss.
期刊介绍:
AEÜ is an international scientific journal which publishes both original works and invited tutorials. The journal''s scope covers all aspects of theory and design of circuits, systems and devices for electronics, signal processing, and communication, including:
signal and system theory, digital signal processing
network theory and circuit design
information theory, communication theory and techniques, modulation, source and channel coding
switching theory and techniques, communication protocols
optical communications
microwave theory and techniques, radar, sonar
antennas, wave propagation
AEÜ publishes full papers and letters with very short turn around time but a high standard review process. Review cycles are typically finished within twelve weeks by application of modern electronic communication facilities.