Monitoring the curing, degradation and moisture ingress into alkyl 2-cyanoacrylate adhesives using electrochemical impedance spectroscopy

IF 2.6 4区 化学 Q3 ELECTROCHEMISTRY Journal of Solid State Electrochemistry Pub Date : 2024-07-15 DOI:10.1007/s10008-024-06003-4
Kevin Raheem, John Cassidy, Bernard Ryan, Anthony Betts
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Abstract

Electrochemical impedance spectroscopy (EIS) was employed in an attempt to gain insight into the mechanisms of ethyl 2-cyanoacrylate (ECA) curing (polymerisation) and bonding on aluminium alloy 2024 metal. EIS can detect ionic movement, adsorption processes, charge transfer and storage occurring at an adhesive/substrate interface and/or in a bulk bond line during curing. Low-frequency capacitance measurements demonstrated sensitivity to surface polymerisation reactions and were modelled using an equivalent circuit model with two time constants in series. At a frequency of 1 kHz, changes in the dielectric polymer could be readily followed with time, confirmed by employing a crown ether to accelerate the polymerisation process. Hydrolytic degradation of poly-ECA bonds at a stainless steel interface was also investigated. An equivalent circuit model containing a number of circuit components comprising pore, charge transfer and diffusional impedances, along with polymer film, double layer and diffusional capacitances (represented by constant phase elements), was developed. Three regions were identified in the frequency domain and ascribed to processes taking place at the polymer/electrolyte and polymer/metal oxide interfaces. In short, EIS can be employed to follow the rate of polymerisation of ethyl-2-cyanoacrylate and also the degradation of the resulting polymer in saline solution.

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利用电化学阻抗谱监测 2-氰基丙烯酸酯烷基粘合剂的固化、降解和水分渗入情况
为了深入了解 2-氰基丙烯酸乙酯(ECA)在铝合金 2024 金属上固化(聚合)和粘合的机理,我们采用了电化学阻抗光谱法(EIS)。EIS 可以检测固化过程中发生在粘合剂/基材界面和/或大块粘合线的离子移动、吸附过程、电荷转移和存储。低频电容测量显示了对表面聚合反应的敏感性,并使用两个时间常数串联的等效电路模型进行建模。在频率为 1 kHz 时,可以很容易地跟踪介电聚合物随时间发生的变化,通过使用冠醚加速聚合过程也证实了这一点。此外,还研究了聚-ECA 键在不锈钢界面上的水解降解。研究开发了一个等效电路模型,其中包含多个电路元件,包括孔隙、电荷转移和扩散阻抗,以及聚合物薄膜、双层和扩散电容(由恒定相位元件表示)。在频域中确定了三个区域,并将其归因于聚合物/电解质和聚合物/金属氧化物界面上发生的过程。简而言之,EIS 可用于跟踪 2-氰基丙烯酸乙酯的聚合速率,以及由此产生的聚合物在盐溶液中的降解过程。
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来源期刊
CiteScore
4.80
自引率
4.00%
发文量
227
审稿时长
4.1 months
期刊介绍: The Journal of Solid State Electrochemistry is devoted to all aspects of solid-state chemistry and solid-state physics in electrochemistry. The Journal of Solid State Electrochemistry publishes papers on all aspects of electrochemistry of solid compounds, including experimental and theoretical, basic and applied work. It equally publishes papers on the thermodynamics and kinetics of electrochemical reactions if at least one actively participating phase is solid. Also of interest are articles on the transport of ions and electrons in solids whenever these processes are relevant to electrochemical reactions and on the use of solid-state electrochemical reactions in the analysis of solids and their surfaces. The journal covers solid-state electrochemistry and focusses on the following fields: mechanisms of solid-state electrochemical reactions, semiconductor electrochemistry, electrochemical batteries, accumulators and fuel cells, electrochemical mineral leaching, galvanic metal plating, electrochemical potential memory devices, solid-state electrochemical sensors, ion and electron transport in solid materials and polymers, electrocatalysis, photoelectrochemistry, corrosion of solid materials, solid-state electroanalysis, electrochemical machining of materials, electrochromism and electrochromic devices, new electrochemical solid-state synthesis. The Journal of Solid State Electrochemistry makes the professional in research and industry aware of this swift progress and its importance for future developments and success in the above-mentioned fields.
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