Effect of cold metal transfer process on hardfacing of Inconel 718 over stainless steel 304

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-07-18 DOI:10.1016/j.matlet.2024.137030

引用次数: 0

Abstract

Stainless Steel 304 (SS304) is hard-faced with the Inconel 718 (IN718) using Cold Metal Transfer (CMT) by stringer beads with 30 % overlapping. Hard-Faced Layer (HFL) showed a dilution of 23.7 %. And it has columnar and equiaxed grains. Additionally, bead overlapping restricts the grain growth and forms fine equiaxed grains. HFL’s microhardness value was 30.3 % greater than the substrate. Also, exhibhits maximum UTS of 738 MPa with maximum elongation of 35 %. Hard-faced layer shows high impact energy values (309 J). Further, HFL offers the better hot corrosion resistance. Fracture and corroded surface morphologies reveals the fracture modes and protective layer failures.

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冷金属转移工艺对不锈钢 304 上铬镍铁合金 718 硬面的影响

不锈钢 304（SS304）与铬镍铁合金 718（IN718）采用冷金属转移（CMT）技术进行硬面处理，串珠重叠 30%。硬面层（HFL）的稀释度为 23.7%。它具有柱状和等轴晶粒。此外，珠子重叠限制了晶粒的生长，形成了细小的等轴晶粒。HFL 的显微硬度值比基体高 30.3%。此外，其最大 UTS 为 738 兆帕，最大伸长率为 35%。硬面层显示出较高的冲击能值（309 J）。此外，HFL 还具有更好的耐热腐蚀性。断裂和腐蚀表面形态显示了断裂模式和保护层失效。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive