Debonding inspection with an enhanced miniature EMAT based on multiple pulse echoes

IF 3.2 3区材料科学 Q2 ENGINEERING, CHEMICAL International Journal of Adhesion and Adhesives Pub Date : 2024-07-19 DOI:10.1016/j.ijadhadh.2024.103797

{"title":"Debonding inspection with an enhanced miniature EMAT based on multiple pulse echoes","authors":"","doi":"10.1016/j.ijadhadh.2024.103797","DOIUrl":null,"url":null,"abstract":"<div><p>The present paper proposes a non-contact ultrasonic testing method for the debonding inspection of metal-based composite structures, utilizing an improved electromagnetic acoustic transducer (EMAT). The enhanced EMAT incorporates a carbonyl iron powder coil backplate and a small butterfly coil to enhance the detecting ability for interfacial bonding. A two-dimensional finite element model is developed to quantify the effectiveness of the carbonyl iron powder coil backplate on increasing the eddy current density and the magnetic flux density in the specimen. An experimental setup was designed using the Ritec SNAP 5000 and the improved EMATs to examine an aluminium-epoxy resin composite structure. Ultrasonic C-scan images of the specimen's bonding interface were obtained from the experiment. Both simulation and experimental results show that carbonyl iron powder coil backplates can increase the efficiency of the EMATs. By investigating the influence of echo number on debonding detection, it was revealed that employing higher-order echoes and utilizing carbonyl iron powder as the coil backplate can enhance the debonding detection capability. The C-scan imaging results indicate that the utilization of high-order echoes enhances imaging quality, and the employment of high-quality miniaturized EMATs enhances the capability for quantitative analysis of debonding defects.</p></div>","PeriodicalId":13732,"journal":{"name":"International Journal of Adhesion and Adhesives","volume":null,"pages":null},"PeriodicalIF":3.2000,"publicationDate":"2024-07-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Adhesion and Adhesives","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0143749624001799","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}

引用次数: 0

Abstract

The present paper proposes a non-contact ultrasonic testing method for the debonding inspection of metal-based composite structures, utilizing an improved electromagnetic acoustic transducer (EMAT). The enhanced EMAT incorporates a carbonyl iron powder coil backplate and a small butterfly coil to enhance the detecting ability for interfacial bonding. A two-dimensional finite element model is developed to quantify the effectiveness of the carbonyl iron powder coil backplate on increasing the eddy current density and the magnetic flux density in the specimen. An experimental setup was designed using the Ritec SNAP 5000 and the improved EMATs to examine an aluminium-epoxy resin composite structure. Ultrasonic C-scan images of the specimen's bonding interface were obtained from the experiment. Both simulation and experimental results show that carbonyl iron powder coil backplates can increase the efficiency of the EMATs. By investigating the influence of echo number on debonding detection, it was revealed that employing higher-order echoes and utilizing carbonyl iron powder as the coil backplate can enhance the debonding detection capability. The C-scan imaging results indicate that the utilization of high-order echoes enhances imaging quality, and the employment of high-quality miniaturized EMATs enhances the capability for quantitative analysis of debonding defects.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

利用基于多脉冲回波的增强型微型电磁超声波探头进行脱粘检测

本文提出了一种用于金属基复合材料结构脱粘检测的非接触超声波测试方法，该方法利用了一种改进型电磁声换能器（EMAT）。改进型电磁声换能器采用了羰基铁粉线圈背板和小型蝶形线圈，以增强对界面粘接的检测能力。建立了一个二维有限元模型，以量化羰基铁粉线圈背板对提高试样中涡流密度和磁通密度的作用。使用 Ritec SNAP 5000 和改进型 EMAT 设计了一套实验装置，用于检测铝-环氧树脂复合材料结构。实验获得了试样粘合界面的超声波 C 扫描图像。模拟和实验结果都表明，羰基铁粉线圈背板可以提高 EMAT 的效率。通过研究回波数对脱粘检测的影响，发现采用高阶回波和使用羰基铁粉作为线圈背板可以提高脱粘检测能力。C 扫描成像结果表明，使用高阶回波可提高成像质量，而使用高质量的微型电磁超声波探头可增强对脱胶缺陷的定量分析能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

International Journal of Adhesion and Adhesives 工程技术-材料科学：综合

CiteScore

6.90

自引率

8.80%

发文量

200

审稿时长

8.3 months

期刊介绍： The International Journal of Adhesion and Adhesives draws together the many aspects of the science and technology of adhesive materials, from fundamental research and development work to industrial applications. Subject areas covered include: interfacial interactions, surface chemistry, methods of testing, accumulation of test data on physical and mechanical properties, environmental effects, new adhesive materials, sealants, design of bonded joints, and manufacturing technology.