Electrical and Optical Diagnosis of Underwater Pulsed Arc Discharge at Different Conductivities

IF 3.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-19 DOI:10.1109/TDEI.2024.3431464

Shijie Huang;Yi Liu;Liuxia Li;Chenqian Zeng;Fuchang Lin

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Abstract

The electrical conductivity is a key parameter affecting the characteristics of pulsed discharge. In the needle-needle electrode configuration, this article investigated the electrical and optical characteristics of underwater microsecond pulsed arc discharge with conductivities ranging from 390 to

$2500~\mu $

S/cm. The effect of conductivity on average pre-breakdown delay and breakdown voltage was evaluated overall. For six typical discharge cases under different conductivities, a comparative analysis of discharge characteristics before and after gap breakdown was conducted. Higher conductivity resulted in increased conduction current and energy leakage during the pre-breakdown stage, thereby influencing the arc discharge stage. Images and emission spectra of the plasma channel under different conductivities were captured, the morphology of the arc channel was compared, and the time-varying characteristics of the electron density were diagnosed. The results demonstrated that the conductivity changed the energy deposition characteristics of the plasma channel, consequently affecting electron density.

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不同导电率水下脉冲电弧放电的电学和光学诊断

电导率是影响脉冲放电特性的关键参数。在针-针电极结构下，研究了水下微秒脉冲电弧放电的电学和光学特性，电导率范围为390 ~ 2500~\mu $ S/cm。全面评价了电导率对平均预击穿延迟和击穿电压的影响。针对不同电导率下的6种典型放电情况，对间隙击穿前后的放电特性进行了对比分析。较高的电导率导致预击穿阶段的传导电流增大和能量泄漏，从而影响电弧放电阶段。捕获了不同电导率下等离子体通道的图像和发射光谱，比较了电弧通道的形貌，诊断了电子密度的时变特征。结果表明，电导率改变了等离子体通道的能量沉积特性，从而影响了电子密度。

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来源期刊

IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程：电子与电气

CiteScore

6.00

自引率

22.60%

发文量

309

审稿时长

5.2 months

期刊介绍： Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.