Analyzing antimicrobial activity of ZnO/FTO, Sn-Cu-doped ZnO/FTO thin films: Production and characterizations.

IF 2 3区 工程技术 Q2 ANATOMY & MORPHOLOGY Microscopy Research and Technique Pub Date : 2024-07-25 DOI:10.1002/jemt.24638
Ilker Kara, Abjar Ibrahim Rashid Hafedh, Nooralhuda Kareem Hanoon Alhusseinawi, Ahmet Furkan Kayış, Özcan Yalçınkaya, Berat Cinar Acar, Zehranur Yuksekdag, Yunus Ozen, Olcay Gençyılmaz, Engin Can Ozkan, Hayrettin Oner
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Abstract

In the developing field of nanotechnology, ZnO (zinc oxide) based semiconductor samples have emerged as the foremost choice due to their immense potential for advancing the development of cutting-edge nanodevices. Due to its excellent chemical stability, low cost, and non-toxicity to biological systems, it is also utilized in various investigations. In this study, the successive ionic layer adsorption and reaction (SILAR) method was used to generate FTO (fluorine-doped tin oxide)/ZnO, and tin (Sn)-copper (Cu)-doped ZnO thin films at varying concentrations on FTO substrates. After being stacked 40 times in varying concentrations on the FTO substrate, FTO/ZnO thin films and Sn-Cu-doped thin films were annealed at 300°C. Using Scanning Electron Microscopy (SEM) Energy Dispersive Spectroscopy-(EDS), the agar diffusion test, and the viability cell counting method, the minimum inhibitory concentration, structural properties, surface morphology, antibacterial properties, bacterial adhesion, and survival organism count of FTO/ZnO thin films and Sn-Cu-doped thin films were investigated. Both doped and FTO/ZnO films with varying Sn-Cu concentrations expanded harmonically on the FTO substrate, according to the SEM-EDS investigation. The doping concentration affected their morphological properties, causing changes depending on the doping level. Antibacterial activity was observed in the powder metals, but no antibacterial activity was found in the thin film form. The highest adhesion rate of bacterial organisms on the produced samples was observed when the FTO/ZnO/Sn-Cu doping rate was 1%. In addition, the lowest adhesion rate was observed when the FTO/ZnO/Sn-Cu additive ratio was 3%. RESEARCH HIGHLIGHTS: ZnO based semiconductors highlight significant potential in advancing nanodevice technology due to their chemical stability, cost-effectiveness, and biocompatibility. Employing the SILAR method, the study innovatively fabricates FTO/ZnO and Sn-Cu-doped ZnO thin films on FTO substrates, exploring a novel approach in semiconductor manufacturing. Post annealing at 300°C, the research examines the structural and surface morphological changes in the films, contributing to the understanding of semiconductor behavior under varying conditions. The study delves into the antibacterial properties of ZnO thin films, offering insights into the potential biomedical applications of these materials. SEM-EDS analysis reveals that doping concentrations crucially influence the morphological properties of ZnO thin films, shedding light on the optimization of semiconductor performance. Findings indicate a specific doping rate (1% Sn-Cu) enhances bacterial adhesion, while a 3% additive ratio minimizes it, suggesting implications for biomedical device engineering and antibacterial surface design.

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分析 ZnO/FTO 和 Sn-Cu 掺杂 ZnO/FTO 薄膜的抗菌活性:生产和表征。
在不断发展的纳米技术领域,基于氧化锌(ZnO)的半导体样品因其在推动尖端纳米设备开发方面的巨大潜力而成为首选。由于其出色的化学稳定性、低成本和对生物系统无毒性,它也被用于各种研究中。本研究采用连续离子层吸附和反应(SILAR)方法,在 FTO 基底上生成不同浓度的 FTO(掺氟氧化锡)/ZnO 和锡(Sn)-铜(Cu)掺杂 ZnO 薄膜。将不同浓度的 FTO/ZnO 薄膜和锡(Sn)-铜(Cu)掺杂 ZnO 薄膜在 FTO 基底上堆叠 40 次后,在 300°C 下退火。利用扫描电子显微镜(SEM)、能量色散光谱(EDS)、琼脂扩散试验和存活细胞计数法,研究了 FTO/ZnO 薄膜和掺杂锡铜薄膜的最小抑菌浓度、结构特性、表面形貌、抗菌性能、细菌粘附性和存活菌数。根据扫描电镜-电子显微镜 (SEM-EDS) 的研究,不同掺杂浓度的 FTO/ZnO 薄膜和 FTO/ZnO 薄膜都在 FTO 基底上和谐地扩展。掺杂浓度影响了它们的形态特性,并根据掺杂水平的不同而发生变化。在粉末金属中观察到了抗菌活性,但在薄膜形式中没有发现抗菌活性。当 FTO/ZnO/Sn-Cu 的掺杂率为 1%时,生产出的样品上细菌的附着率最高。此外,当 FTO/ZnO/Sn-Cu 添加率为 3% 时,观察到的附着率最低。研究亮点:基于氧化锌的半导体因其化学稳定性、成本效益和生物相容性,在推动纳米器件技术方面具有巨大潜力。该研究采用 SILAR 方法,在 FTO 基底上创新性地制造出 FTO/ZnO 和 Sn-Cu 掺杂的 ZnO 薄膜,探索了一种新型半导体制造方法。在 300°C 退火后,研究人员检查了薄膜的结构和表面形态变化,有助于了解半导体在不同条件下的行为。研究深入探讨了氧化锌薄膜的抗菌特性,为这些材料的潜在生物医学应用提供了见解。SEM-EDS 分析表明,掺杂浓度对氧化锌薄膜的形态特性有着至关重要的影响,为优化半导体性能提供了启示。研究结果表明,特定的掺杂率(1% 锡-铜)会增强细菌的附着力,而 3% 的添加率则会将细菌的附着力降至最低,这对生物医学设备工程和抗菌表面设计具有重要意义。
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来源期刊
Microscopy Research and Technique
Microscopy Research and Technique 医学-解剖学与形态学
CiteScore
5.30
自引率
20.00%
发文量
233
审稿时长
4.7 months
期刊介绍: Microscopy Research and Technique (MRT) publishes articles on all aspects of advanced microscopy original architecture and methodologies with applications in the biological, clinical, chemical, and materials sciences. Original basic and applied research as well as technical papers dealing with the various subsets of microscopy are encouraged. MRT is the right form for those developing new microscopy methods or using the microscope to answer key questions in basic and applied research.
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