3D Reconstruction of a High-Energy Diffraction Microscopy Sample Using Multi-modal Serial Sectioning with High-Precision EBSD and Surface Profilometry

IF 2.4 3区 材料科学 Q3 ENGINEERING, MANUFACTURING Integrating Materials and Manufacturing Innovation Pub Date : 2024-07-24 DOI:10.1007/s40192-024-00370-6
Gregory Sparks, Simon A. Mason, Michael G. Chapman, Jun-Sang Park, Hemant Sharma, Peter Kenesei, Stephen R. Niezgoda, Michael J. Mills, Michael D. Uchic, Paul A. Shade, Mark Obstalecki
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Abstract

High-energy diffraction microscopy (HEDM) combined with in situ mechanical testing is a powerful nondestructive technique for tracking the evolving microstructure within polycrystalline materials during deformation. This technique relies on a sophisticated analysis of X-ray diffraction patterns to produce a three-dimensional reconstruction of grains and other microstructural features within the interrogated volume. However, it is known that HEDM can fail to identify certain microstructural features, particularly smaller grains or twinned regions. Characterization of the identical sample volume using high-resolution surface-specific techniques, particularly electron backscatter diffraction (EBSD), can not only provide additional microstructure information about the interrogated volume but also highlight opportunities for improvement of the HEDM reconstruction algorithms. In this study, a sample fabricated from undeformed “low solvus, high refractory” nickel-based superalloy was scanned using HEDM. The volume interrogated by HEDM was then carefully characterized using a combination of surface-specific techniques, including epi-illumination optical microscopy, zero-tilt secondary and backscattered electron imaging, scanning white light interferometry, and high-precision EBSD. Custom data fusion protocols were developed to integrate and align the microstructure maps captured by these surface-specific techniques and HEDM. The raw and processed data from HEDM and serial sectioning have been made available via the Materials Data Facility (MDF) at https://doi.org/10.18126/4y0p-v604 for further investigation.

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利用多模态序列切片与高精度 EBSD 和表面轮廓测量法重建高能衍射显微镜样品的三维结构
高能衍射显微镜(HEDM)与原位机械测试相结合,是一种强大的无损技术,可用于跟踪多晶材料在变形过程中不断演变的微观结构。该技术依赖于对 X 射线衍射图样的复杂分析,以生成晶粒的三维重建图,以及所检测体积内的其他微观结构特征。然而,众所周知,HEDM 可能无法识别某些微观结构特征,尤其是较小的晶粒或孪晶区域。使用高分辨率表面特异性技术,特别是电子反向散射衍射(EBSD)对相同的样品体积进行表征,不仅可以提供有关询问体积的更多微观结构信息,还能突出改进 HEDM 重建算法的机会。在本研究中,使用 HEDM 扫描了由未变形的 "低溶解度、高耐火度 "镍基超级合金制成的样品。然后,利用外延照明光学显微镜、零倾斜二次电子和背散射电子成像、扫描白光干涉仪和高精度 EBSD 等表面特定技术的组合,对 HEDM 扫描的体积进行了仔细的表征。开发了定制数据融合协议,以整合和校准这些特定表面技术和 HEDM 采集的微观结构图。HEDM 和序列切片的原始数据和处理数据已通过 https://doi.org/10.18126/4y0p-v604 的材料数据设施(MDF)提供,供进一步研究使用。
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来源期刊
Integrating Materials and Manufacturing Innovation
Integrating Materials and Manufacturing Innovation Engineering-Industrial and Manufacturing Engineering
CiteScore
5.30
自引率
9.10%
发文量
42
审稿时长
39 days
期刊介绍: The journal will publish: Research that supports building a model-based definition of materials and processes that is compatible with model-based engineering design processes and multidisciplinary design optimization; Descriptions of novel experimental or computational tools or data analysis techniques, and their application, that are to be used for ICME; Best practices in verification and validation of computational tools, sensitivity analysis, uncertainty quantification, and data management, as well as standards and protocols for software integration and exchange of data; In-depth descriptions of data, databases, and database tools; Detailed case studies on efforts, and their impact, that integrate experiment and computation to solve an enduring engineering problem in materials and manufacturing.
期刊最新文献
Comparison of Full-Field Crystal Plasticity Simulations to Synchrotron Experiments: Detailed Investigation of Mispredictions 3D Reconstruction of a High-Energy Diffraction Microscopy Sample Using Multi-modal Serial Sectioning with High-Precision EBSD and Surface Profilometry L-PBF High-Throughput Data Pipeline Approach for Multi-modal Integration How Well Do Large Language Models Understand Tables in Materials Science? Outcomes and Conclusions from the 2022 AM Bench Measurements, Challenge Problems, Modeling Submissions, and Conference
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