From silicon shield to carbon lock-in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020)

IF 4.9 3区 环境科学与生态学 Q2 ENGINEERING, ENVIRONMENTAL Journal of Industrial Ecology Pub Date : 2024-07-24 DOI:10.1111/jiec.13487
Gauthier Roussilhe, Thibault Pirson, Mathieu Xhonneux, David Bol
{"title":"From silicon shield to carbon lock-in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020)","authors":"Gauthier Roussilhe,&nbsp;Thibault Pirson,&nbsp;Mathieu Xhonneux,&nbsp;David Bol","doi":"10.1111/jiec.13487","DOIUrl":null,"url":null,"abstract":"<p>Taiwan plans to rapidly increase its industrial production capacity of electronic components while concurrently setting policies for its ecological transition. Given that the island is responsible for the manufacturing of a significant part of worldwide electronics components (including the most advanced CMOS technology nodes), the sustainability of the Taiwanese electronics industry is of critical interest. In this paper, we survey the environmental footprint of 16 Taiwanese electronic components manufacturers (ECMs) using corporate sustainability responsibility reports. Based on data from 2015 to 2020, we find out that the sample of ECMs in this study increased its greenhouse gas emissions by 7.5% per year, its final energy and electricity consumption by 8.8% and 8.9%, and its water usage by 6.1%. We show that the volume of manufactured electronic components and the environmental footprint compiled in this study are strongly correlated, which suggests that relative efficiency gains are not sufficient to curb the overall environmental footprint of ECMs on the island. Given the critical nature of the electronics industry for Taiwan's geopolitics and economics, the observed increase of energy consumption, and the slow renewable energy roll-out, Taiwan could face a carbon lock-in situation which will most likely prevent the achievement of carbon reduction goals and sustainability policies on the island.</p>","PeriodicalId":16050,"journal":{"name":"Journal of Industrial Ecology","volume":"28 5","pages":"1212-1226"},"PeriodicalIF":4.9000,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Industrial Ecology","FirstCategoryId":"93","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1111/jiec.13487","RegionNum":3,"RegionCategory":"环境科学与生态学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ENVIRONMENTAL","Score":null,"Total":0}
引用次数: 0

Abstract

Taiwan plans to rapidly increase its industrial production capacity of electronic components while concurrently setting policies for its ecological transition. Given that the island is responsible for the manufacturing of a significant part of worldwide electronics components (including the most advanced CMOS technology nodes), the sustainability of the Taiwanese electronics industry is of critical interest. In this paper, we survey the environmental footprint of 16 Taiwanese electronic components manufacturers (ECMs) using corporate sustainability responsibility reports. Based on data from 2015 to 2020, we find out that the sample of ECMs in this study increased its greenhouse gas emissions by 7.5% per year, its final energy and electricity consumption by 8.8% and 8.9%, and its water usage by 6.1%. We show that the volume of manufactured electronic components and the environmental footprint compiled in this study are strongly correlated, which suggests that relative efficiency gains are not sufficient to curb the overall environmental footprint of ECMs on the island. Given the critical nature of the electronics industry for Taiwan's geopolitics and economics, the observed increase of energy consumption, and the slow renewable energy roll-out, Taiwan could face a carbon lock-in situation which will most likely prevent the achievement of carbon reduction goals and sustainability policies on the island.

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
从硅屏蔽到碳锁定?台湾电子元件制造业的环境足迹(2015-2020 年)
台湾计划迅速提高电子元件的工业生产能力,同时制定生态转型政策。鉴于台湾岛负责制造全球电子元件的重要部分(包括最先进的 CMOS 技术节点),台湾电子产业的可持续发展备受关注。在本文中,我们利用企业可持续发展责任报告调查了 16 家台湾电子元件制造商(ECM)的环境足迹。根据 2015 年至 2020 年的数据,我们发现本研究中的电子元件制造商样本每年的温室气体排放量增加了 7.5%,最终能源和电力消耗量分别增加了 8.8% 和 8.9%,用水量增加了 6.1%。我们的研究表明,电子元件的制造量与本研究中编制的环境足迹密切相关,这表明相对效率的提高不足以抑制岛上电子元件制造的整体环境足迹。鉴于电子产业对台湾地缘政治和经济的重要性、所观察到的能源消耗增长以及可再生能源推广的缓慢,台湾可能面临碳锁定的局面,这很可能阻碍台湾岛内碳减排目标和可持续发展政策的实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Journal of Industrial Ecology
Journal of Industrial Ecology 环境科学-环境科学
CiteScore
11.60
自引率
8.50%
发文量
117
审稿时长
12-24 weeks
期刊介绍: The Journal of Industrial Ecology addresses a series of related topics: material and energy flows studies (''industrial metabolism'') technological change dematerialization and decarbonization life cycle planning, design and assessment design for the environment extended producer responsibility (''product stewardship'') eco-industrial parks (''industrial symbiosis'') product-oriented environmental policy eco-efficiency Journal of Industrial Ecology is open to and encourages submissions that are interdisciplinary in approach. In addition to more formal academic papers, the journal seeks to provide a forum for continuing exchange of information and opinions through contributions from scholars, environmental managers, policymakers, advocates and others involved in environmental science, management and policy.
期刊最新文献
Issue Information, Cover, and Table of Contents Prospective life cycle assessment of climate and biodiversity impacts of meat‐based and plant‐forward meals: A case study of Indonesian and German meal options Unpacking the path toward a sustainable circular economy through industrial ecology An integrated urban metabolism and ecosystem service assessment: The case study of Lima, Peru Additive inclusion in plastic life cycle assessments part I: Review of mechanical recycling studies
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1