Mechanical and microstructural investigation of three-dimensionally printed PEEK polymer

Chithambaram Karunanithi, Senthilnathan Natarajan
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Abstract

Three-dimensional polymer printing is becoming more popular due to its effectiveness in creating components of any geometric design. Polymer materials can be used at low temperatures but are weaker than other functional materials. Polyetheretherketone (PEEK) is a thermoplastic with outstanding mechanical properties that can tolerate high temperatures. A high-temperature fused deposition modeling machine manufactured PEEK specimens in this experiment to find the ideal printing parameters S1, S2, S3, and S4 were made using varying printing speeds and layer thicknesses. The polymer sample’s exterior surface was analyzed using FESEM, while physical characterization was conducted through X-ray diffraction analysis and water contact angle measurement. The strength of each sample in the relevant variables was determined using mechanical testing, such as tensile and compression tests. It was found that specimen S3 having a layer thickness of 0.15 mm and printing speed of 20 mm/s showed a high tensile and compressive strength value of about 78 and 144 MPa respectively than the other three samples. In addition, the fractured tensile samples were analyzed with scanning electron microscopy to discover the factors that contributed to the disparity in the values of their strengths.
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三维打印 PEEK 聚合物的机械和微结构研究
三维聚合物打印因其在创建任何几何设计组件方面的有效性而越来越受欢迎。聚合物材料可在低温下使用,但比其他功能材料较弱。聚醚醚酮(PEEK)是一种热塑性塑料,具有出色的机械性能,可以耐高温。本实验使用高温熔融沉积建模机制造 PEEK 试样,以找到理想的打印参数 S1、S2、S3 和 S4,并使用不同的打印速度和层厚进行打印。聚合物试样的外表面使用 FESEM 进行了分析,而物理特性则通过 X 射线衍射分析和水接触角测量进行了分析。通过拉伸和压缩试验等机械测试确定了每个样品在相关变量中的强度。结果发现,层厚为 0.15 毫米、印刷速度为 20 毫米/秒的试样 S3 比其他三个试样的抗拉强度和抗压强度分别高出约 78 和 144 兆帕。此外,还利用扫描电子显微镜对断裂的拉伸试样进行了分析,以发现造成其强度值差异的因素。
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来源期刊
CiteScore
3.80
自引率
10.00%
发文量
625
审稿时长
4.3 months
期刊介绍: The Journal of Mechanical Engineering Science advances the understanding of both the fundamentals of engineering science and its application to the solution of challenges and problems in engineering.
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