The influence of sub-surface damage microstructure on ultra-thin die flexural strength

Liu Shu, Chongyang Li, Yunwen Wu, Tao Hang, Lei Liu, Ming Li
{"title":"The influence of sub-surface damage microstructure on ultra-thin die flexural strength","authors":"Liu Shu, Chongyang Li, Yunwen Wu, Tao Hang, Lei Liu, Ming Li","doi":"10.1016/j.jmrt.2024.07.121","DOIUrl":null,"url":null,"abstract":"In the semiconductor industry, where miniaturization is a key driver, mechanical properties of ultra-thin dies are increasingly important research topics. Sub-surface damage (SSD) is a common issue in wafer thinning processes, but there is a lack of research on the relationship between SSD microstructure and ultra-thin die strength. In this study, the influence of SSD microstructure on flexural strength was investigated through three-point bending tests of ultra-thin dies prepared by distinct wafer-thinning methods, coupled with SSD microstructure characterization. Flexural strength was highest for dies dry polished with N pad, intermediate for dies dry polished with M pad, and lowest for dies with fine grinding. We researched SSD microstructure by high-resolution transmitted electron microscope (HRTEM), revealing that it comprises amorphous regions, micro-cracks, and high-density distortion areas. The SSD of the fine grinding samples was thick and intermittent, with observable micro-cracks. Comparatively, the SSD structure from M pad polishing was uniform but thicker, whereas SSD from N pad polishing was thinner but exhibited greater variability. SSD thickness not only influences the average value but also dictates the distribution of flexural strength. This research enhances the understanding of SSD microstructure's impact on ultra-thin die flexural strength, providing valuable insights for optimizing wafer thinning processes to enhance die reliability.","PeriodicalId":501120,"journal":{"name":"Journal of Materials Research and Technology","volume":"8 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Research and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.jmrt.2024.07.121","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

In the semiconductor industry, where miniaturization is a key driver, mechanical properties of ultra-thin dies are increasingly important research topics. Sub-surface damage (SSD) is a common issue in wafer thinning processes, but there is a lack of research on the relationship between SSD microstructure and ultra-thin die strength. In this study, the influence of SSD microstructure on flexural strength was investigated through three-point bending tests of ultra-thin dies prepared by distinct wafer-thinning methods, coupled with SSD microstructure characterization. Flexural strength was highest for dies dry polished with N pad, intermediate for dies dry polished with M pad, and lowest for dies with fine grinding. We researched SSD microstructure by high-resolution transmitted electron microscope (HRTEM), revealing that it comprises amorphous regions, micro-cracks, and high-density distortion areas. The SSD of the fine grinding samples was thick and intermittent, with observable micro-cracks. Comparatively, the SSD structure from M pad polishing was uniform but thicker, whereas SSD from N pad polishing was thinner but exhibited greater variability. SSD thickness not only influences the average value but also dictates the distribution of flexural strength. This research enhances the understanding of SSD microstructure's impact on ultra-thin die flexural strength, providing valuable insights for optimizing wafer thinning processes to enhance die reliability.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
表层下损伤微观结构对超薄模具抗弯强度的影响
在以微型化为主要驱动力的半导体行业,超薄芯片的机械性能日益成为重要的研究课题。表面下损伤(SSD)是晶圆减薄过程中的常见问题,但目前还缺乏关于 SSD 微观结构与超薄模具强度之间关系的研究。在本研究中,通过对采用不同晶片减薄方法制备的超薄模具进行三点弯曲测试,并结合 SSD 微观结构表征,研究了 SSD 微观结构对抗弯强度的影响。使用 N 垫干磨的模具抗弯强度最高,使用 M 垫干磨的模具抗弯强度居中,而使用精磨的模具抗弯强度最低。我们用高分辨率透射电子显微镜(HRTEM)研究了 SSD 的微观结构,发现它包括非晶区、微裂纹和高密度变形区。精磨样品的 SSD 较厚且断断续续,可观察到微裂纹。相比之下,M 研磨垫抛光的 SSD 结构均匀但较厚,而 N 研磨垫抛光的 SSD 较薄但变化较大。SSD 厚度不仅影响平均值,还决定了抗弯强度的分布。这项研究加深了人们对固态硬碟微观结构对超薄芯片抗弯强度影响的理解,为优化晶片减薄工艺以提高芯片可靠性提供了宝贵的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Revealing the microstructural evolution and mechanical response of repaired Fe–Cr–Si based alloy by directed energy deposition Non-planar additive manufacturing of pre-impregnated continuous fiber reinforced composites using a three-axis printer Microstructure and mechanical property of high-density 7075 Al alloy by compression molding of POM-based feedstock Effect of microstructural inheritance window on the mechanical properties of an intercritically annealed Q&P steel Clarifying the effect of irradiation and thermal treatment on the austenitic microstructure and austenitic hardening in austenitic stainless steel weld metal
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1