{"title":"Noncontact measurement of density and thermal properties of SS 316L powder bed through flash thermography","authors":"Shu Wang, Nathan B. Crane","doi":"10.1108/rpj-01-2024-0049","DOIUrl":null,"url":null,"abstract":"\nPurpose\nPowder bed density is a key parameter in powder bed additive manufacturing (AM) processes but is not easily monitored. This research evaluates the possibility of non-invasively estimating the density of an AM powder bed via its thermal properties measured using flash thermography (FT).\n\n\nDesign/methodology/approach\nThe thermal diffusivity and conductivity of the samples were found by fitting an analytical model to the measured surface temperature after flash of the powder on a polymer substrate, enabling the estimation of the powder bed density.\n\n\nFindings\nFT estimated powder bed was within 8% of weight-based density measurements and the inferred thermal properties are consistent with literature findings. However, multiple flashes were necessary to ensure precise measurements due to noise in the experimental data and the similarity of thermal properties between the powder and substrate.\n\n\nOriginality/value\nThis paper emphasizes the capability of Flash Thermography (FT) for non-contact measurement of SS 316 L powder bed density, offering a pathway to in-situ monitoring for powder bed AM methods including binder jetting (BJ) and powder bed fusion. Despite the limitations of the current approach, the density knowledge and thermal properties measurements have the potential to enhance process development and thermal modeling powder bed AM processes, aiding in understanding the powder packing and thermal behavior.\n","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"2 6","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/rpj-01-2024-0049","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Purpose
Powder bed density is a key parameter in powder bed additive manufacturing (AM) processes but is not easily monitored. This research evaluates the possibility of non-invasively estimating the density of an AM powder bed via its thermal properties measured using flash thermography (FT).
Design/methodology/approach
The thermal diffusivity and conductivity of the samples were found by fitting an analytical model to the measured surface temperature after flash of the powder on a polymer substrate, enabling the estimation of the powder bed density.
Findings
FT estimated powder bed was within 8% of weight-based density measurements and the inferred thermal properties are consistent with literature findings. However, multiple flashes were necessary to ensure precise measurements due to noise in the experimental data and the similarity of thermal properties between the powder and substrate.
Originality/value
This paper emphasizes the capability of Flash Thermography (FT) for non-contact measurement of SS 316 L powder bed density, offering a pathway to in-situ monitoring for powder bed AM methods including binder jetting (BJ) and powder bed fusion. Despite the limitations of the current approach, the density knowledge and thermal properties measurements have the potential to enhance process development and thermal modeling powder bed AM processes, aiding in understanding the powder packing and thermal behavior.
目的粉末床密度是粉末床增材制造(AM)工艺中的一个关键参数,但不易监测。本研究评估了通过使用闪光热成像技术(FT)测量粉末床的热特性,以非侵入方式估算粉末床密度的可能性。研究结果FT 估算的粉末床密度在基于重量的密度测量值的 8% 以内,推断的热特性与文献结论一致。然而,由于实验数据中的噪声以及粉末和基底之间热特性的相似性,需要多次闪光才能确保精确测量。 本文强调了闪光热成像 (FT) 非接触式测量 SS 316 L 粉末床密度的能力,为粉末床 AM 方法(包括粘合剂喷射 (BJ) 和粉末床融合)的原位监测提供了途径。尽管目前的方法有其局限性,但密度知识和热特性测量有可能加强工艺开发和粉末床 AM 工艺的热建模,帮助了解粉末填料和热行为。
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
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