Solution to SRAM static power consumption with MTCMOS

Jiyao Yuan, Xiaochuan Xue
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Abstract

The rapid growth of mobile devices has led to an increasing demand for battery life and energy efficiency in recent years, the reduction of circuit power consumption has become extremely crucial. SRAM has become an indispensable component of modern System-on-Chip (SoC) designs, and reducing its power consumption holds significant importance in minimizing overall chip power consumption. On the other hand, as manufacturing processes advance, static power consumption resulting from leakage currents has gradually emerged as a primary source of power consumption. This paper analyzes the power composition of SRAM, provides a detailed explanation of the principles and influencing factors of MTCMOS design technology, and conducts modeling analysis on 6T SRAM based on MTCMOS. In the modeling analysis, we compare the leakage current and static power reduction effects of 6T SRAM using four different process technologies: 28nm, 40nm, 65nm, and 90nm. From the data, it can be observed that MTCMOS has a notable effect in reducing leakage current for 6T SRAM across various process technologies. Comparing 6T SRAM of different process technologies, we can roughly see that the power reduction effect reaches a peak and gradually decreases. However, due to the lack of more advanced process libraries, we cannot further validate whether this inference is accurate.
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利用 MTCMOS 解决 SRAM 静态功耗问题
近年来,移动设备的快速发展导致对电池寿命和能效的要求越来越高,降低电路功耗变得极为重要。SRAM 已成为现代片上系统(SoC)设计中不可或缺的组件,降低其功耗对于最大限度地减少整体芯片功耗具有重要意义。另一方面,随着制造工艺的进步,漏电流产生的静态功耗逐渐成为功耗的主要来源。本文分析了 SRAM 的功耗构成,详细阐述了 MTCMOS 设计技术的原理和影响因素,并对基于 MTCMOS 的 6T SRAM 进行了建模分析。在建模分析中,我们比较了采用 28 纳米、40 纳米、65 纳米和 90 纳米四种不同工艺技术的 6T SRAM 的漏电流和静态功耗降低效果。从数据中可以看出,MTCMOS 在降低不同工艺技术的 6T SRAM 泄漏电流方面效果显著。比较不同工艺技术的 6T SRAM,我们可以大致看出功耗降低效果达到峰值后逐渐降低。不过,由于缺乏更先进的工艺库,我们无法进一步验证这一推论是否准确。
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