Junhua Chen, Yuzhi Nie, Guan Lian, Aijun Chen, Siqi Pu, Jinfeng Zou, Jiasheng Zhang, Xiong Shi, Di Wu, Bai Yang
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引用次数: 0
Abstract
The rigid pile composite foundation method is the most commonly used method for strengthening weak soil foundations. In this method, piles usually need to pass through weak soil layers, and the pile end falls on a bearing layer with good bearing capacity. Under existing technical conditions, the thicker the weak soil layer, the longer the pile body, and the more difficult it is to ensure the construction quality of the pile. In response to this issue, some scholars have adopted the rigid pile composite foundation method with a thick cushion layer for reinforcement treatment. This article uses PLAXIS 3D (V20.04.00.790) software to establish a finite element model of rigid pile composite foundation with a thick cushion layer and simulate the process of foundation reinforcement. The influence of parameters such as thickness, compression modulus, and shear strength index of the cushion layer on foundation settlement and pile–soil stress distribution is studied, and the reasonable range of these parameters is analyzed under the condition of considering reinforcement effect. Through comparative analysis, it can be concluded that for deep and weak soil areas, the thickness of the cushion layer can range from 0.5 to 2.6. The thickness and compressive modulus of the cushion layer have a significant impact on the settlement of the foundation, the pile–soil stress ratio, and the stress of the pile body, while the shear strength index of the cushion layer has a relatively small impact on these parameters. Reasonably selecting the geometric and mechanical parameters of the cushion layer can effectively reduce stress concentration at the pile top and better play the role of the soil between piles.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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