Error analysis for determining transverse tensile delamination strength of REBCO coated conductors by anvil test: numerical simulation demonstrations

Peifeng Gao, Yameng Zhang, Xiaohui Lin, Sikan Chen, Jiamin Zhu, M. Guan, Xingzhe Wang
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Abstract

RE-Ba-Cu-O (REBCO, where RE = Y, Gd, Sm, and other rare earth elements) coated conductor (CC) tapes exhibit considerable potential for application within the domains of high-energy physics and high-field science. Nevertheless, weak interfacial properties pose a significant obstacle, impeding the progress and practical implementation in high-field scenarios. The anvil tension method has been extensively employed for the assessment of transverse delamination strength of REBCO CC tapes. However, the outcomes derived from anvil tension exhibit severe dispersion, thereby impeding its efficacy in evaluating material performance. The underlying cause of this phenomenon remains unidentified. In this study, error analysis of anvil measurement method in determining the transverse tensile delamination strength (TTDS) of REBCO CC tapes was conducted based on finite element (FE) numerical simulations. A two-dimensional multilayer elastic-plastic delamination FE model with main layers of REBCO CC tapes, solder connecting layers and anvil materials were developed based on the bilinear cohesive zone model. The effects of anvil test conditions and the structural configuration of the conductor itself on the test results were discussed. Simulation results show that localized premature cracking of the interface due to stress concentration and plastic yielding of the CC tape around the loading boundary is the root reason for the discrepancy between the anvil test results and the true interfacial strength. Therefore, anvil test conditions (including top anvil dimensions, soldering conditions, loading eccentricity angle, and anvil material properties) as well as the structural configuration of the conductor itself (including edge initial crack length, edge encapsulation width, and stabilizer thickness) have a significant impact on anvil test-based TTDS results.
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通过砧板试验确定 REBCO 涂层导体横向拉伸分层强度的误差分析:数值模拟演示
RE-Ba-Cu-O(REBCO,其中 RE = Y、Gd、Sm 和其他稀土元素)涂层导体(CC)带在高能物理和高场科学领域具有相当大的应用潜力。然而,薄弱的界面特性构成了一个重大障碍,阻碍了高场应用的进展和实际应用。砧板拉伸法已被广泛用于评估 REBCO CC 磁带的横向分层强度。然而,砧板拉伸法得出的结果表现出严重的分散性,从而阻碍了其在评估材料性能方面的功效。造成这种现象的根本原因仍未查明。在本研究中,基于有限元(FE)数值模拟,对确定 REBCO CC 胶带横向拉伸分层强度(TTDS)的砧板测量方法进行了误差分析。基于双线性内聚区模型,建立了包含 REBCO CC 胶带主层、焊料连接层和砧板材料的二维多层弹塑性分层 FE 模型。讨论了砧座测试条件和导体本身的结构配置对测试结果的影响。模拟结果表明,CC 带在加载边界附近的应力集中和塑性屈服导致的界面局部过早开裂是砧座测试结果与真实界面强度之间存在差异的根本原因。因此,砧座测试条件(包括顶部砧座尺寸、焊接条件、加载偏心角和砧座材料特性)以及导体本身的结构配置(包括边缘初始裂纹长度、边缘封装宽度和稳定器厚度)对基于砧座测试的 TTDS 结果有重大影响。
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